IP Library Granted Patent US 9,034,137
Granted Patent B2
US 9,034,137 · App. 12/742,568 · Granted May 19, 2015

In-situ, multi-stage debulk, compaction, and single stage curing of thick composite repair laminates

Inventors: Denver R. Whitworth (North Richland Hills, TX); Vance N. Cribb (Grapevine, TX); Dumitru R. Jitariu (Flower Mound, TX)
Assignee: Textron Innovations Inc.
B29C73/10B29C37/0075B32B38/10B32B43/00B32B2605/00B32B2605/18
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Quick Facts
Patent No.
US 9,034,137
App. No.
12/742,568
Granted
May 19, 2015
Kind
B2
Abstract

A method for fabricating a repair laminate for a composite part having an exposed surface includes applying a bonding material to the exposed surface and forming an uncured ply stack assembly on the bonding material. The uncured ply stack assembly is formed by forming and compacting a series of uncured ply stacks. The ply stack assembly and bonding material are then cured.

Claims (23)

1. A method for fabricating a repair laminate for a composite part having a damaged exposed surface, comprising:

preparing the damaged exposed surface for bonding the repair laminate thereon;

applying bonding material to the damaged exposed surface;

forming an uncured ply stack assembly that comprises a first ply stack and a second ply stack, the forming of the uncured ply stack assembly including:

forming a first uncured ply stack over the damaged exposed surface on the bonding material, the first uncured ply stack including a plurality of uncured plies;

applying a vacuum and heat to the thus formed first uncured ply stack prior to forming a second uncured ply stack over the damaged exposed surface, wherein the temperature of the heat applied is below a curing temperature, thus the first uncured ply stack remains uncured after heat is applied;

compacting the first uncured ply stack with the vacuum and heat applied thereto, thereby forming a compacted first uncured ply stack from the first uncured ply stack, the first uncured ply stack remaining uncured but compacted;

forming the second uncured ply stack over the compacted first uncured ply stack, the second uncured ply stack including a plurality of uncured plies; and

applying the vacuum and heat to the thus formed second uncured ply stack, wherein the temperature of the heat applied is below the curing temperature, thus the second uncured ply stack remains uncured after heat is applied; and

compacting the second uncured ply stack with the vacuum and heat applied thereto, the second uncured ply stack remaining uncured but compacted; and

curing the uncured ply stack assembly and bonding material, thus the first ply stack and the second ply stack being cured.

2. The method according to claim 1 , wherein at least one of the first and second uncured ply stacks includes one or more uncured plies comprising polymeric-matrix composite materials.

3. The method according to claim 1 , wherein at least one of the uncured ply stacks comprises fewer than ten uncured plies.

4. The method according to claim 1 , wherein the forming of the uncured ply stack assembly further includes, for each uncured ply stack, at least partially enclosing the uncured ply stack within a sealing bag and attaching the sealing bag to the damaged exposed surface to create an air tight seal around the uncured ply stack.

5. The method according to claim 4 , wherein the applying of the vacuum includes evacuating gases from within the sealing bag.

6. The method according to claim 5 , wherein the applying of the vacuum includes increasing vacuum pressure within the sealing bag to a first pressure level for a first predetermined amount of time.

7. The method according to claim 6 , wherein the applying of the vacuum includes increasing vacuum pressure within the sealing bag to a second pressure level for a second predetermined amount of time.

8. The method according to claim 4 , wherein the applying of the heat includes increasing the temperature within the sealing bag to a first temperature for a first predetermined amount of time.

9. The method according to claim 1 , wherein the applying of the heat includes increasing the temperature of the first uncured ply stack to a first temperature for a first predetermined amount of time.

10. The method according to claim 1 , wherein the curing of the uncured ply stack assembly includes:

at least partially enclosing the uncured ply stack assembly within a sealing bag and attaching the sealing bag to the damaged exposed surface to create an air tight seal around the uncured ply stack assembly;

increasing vacuum pressure within the sealing bag; and

increasing the temperature within the sealing bag to the curing temperature.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 23, 2011
From: BELL HELICOPTER TEXTRON INC.
To: TEXTRON INNOVATIONS INC.
Reel/Frame 026961/0088 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 1, 2010
From: WHITWORTH, DENVER RAY; CRIBB, VANCE NEWTON, III; JITARIU, DUMITRU RADU
To: BELL HELICOPTER TEXTRON INC.
Reel/Frame 024461/0869 →
Continuity (2)
Provisional Application 60990028 · Nov 26, 2007
Related Publication 20100258235A1 · Oct 14, 2010