Ultrasonic probe, and ultrasonic diagnostic apparatus using the same
View Patent ↗An ultrasonic probe including a cMUT chip that has plural oscillation elements whose electromechanical coupling coefficient or sensitivity varies in accordance with a bias voltage and transmits/receives an ultrasonic wave, an acoustic lens provided at an ultrasonic wave transmission/reception side of the cMUT chip, a backing layer provided to the opposite surface of the cMUT chip to the acoustic lens, and a substrate provided between the backing layer and the cMUT chip. The ultrasonic probe further includes thermal stress suppressing means for suppressing thermal stress occurring due to the difference in linear expansion coefficient caused by temperature variation between the substrate and the backing layer.
1. An ultrasonic probe including:
a cMUT (Capacitive Micromachined Ultrasonic Transducer) chip that has plural oscillation elements whose electromechanical coupling coefficient or sensitivity varies in accordance with a bias voltage and transmits/receives an ultrasonic wave;
an acoustic lens provided at an ultrasonic wave transmission/reception side of the cMUT chip; and
a backing layer provided to the opposite surface of the cMUT chip to the acoustic lens,
wherein the cMUT chip has a substrate made of a silicon wafer, the substrate being joined through an adhesive layer with the backing layer that comprises a material including silicon dioxide.
2. The ultrasonic probe according to claim 1 , wherein the backing layer further comprises a metal and a resin, both the metal and the resin having linear expansion coefficients that are different from the linear expansion coefficient of the material.
3. The ultrasonic probe according to claim 2 , wherein the metal is tungsten, and the resin is polyamide resin.
4. The ultrasonic probe according to claim 1 , wherein the material is a fibrous material.
5. The ultrasonic probe according to claim 1 , wherein the difference in the linear expansion coefficient between the backing layer and the substrate is in the range of 50 to 60 ppm/ ° C.
6. The ultrasonic probe according to claim 1 , wherein an adhesive layer used for the adhesive layer has a modulus of elasticity smaller than the modulus of slasticity of the substrate and/or the backing layer.
7. The ultrasonic probe according to claim 6 , wherein the adhesive agent is one of epoxy type, polyurethane type or silicon type.
8. An ultrasonic diagnostic apparatus comprising;
an ultrasonic probe for transmitting/receiving an ultrasonic wave to an examinee;
an image processor for constituting an ultrasonic image on the basis of an ultrasonic reception signal output from the ultrasonic probe; and
a display unit for displaying the ultrasonic image,
wherein the ultrasonic probe is an ultrasonic probe as described in any one of claims 1 , 2 , 4 , 5 , 6 and 7 .