IP Library Patent Application 12744685
Patent Application
App. No. 12/744,685

BENDABLE CIRCUIT STRUCTURE FOR LED MOUNTING AND INTERCONNECTION

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Quick Facts
Patent No.
US None
App. No.
12/744,685
Abstract

This invention is directed to bendable circuit substrate structures useful for LED mounting and interconnection.

Claims (20)

1 . A laminate comprising, on a substrate the following layers:

(e) a copper or aluminum metal layer;

(f) a polyimide or adhesive layer, the metal layer being adjacent to the polyimide or the adhesive layer

(g) a copper foil layer and

(h) a liquid or film solder mask layer.

2 . The laminate of claim 1 wherein the laminate is a thin polymer based copper clad filled polyimide (PI).

3 . The laminate of claim 2 wherein the laminate is a CooLam™ thermal laminate.

4 . The laminate of claim 3 wherein CooLam™ thermal laminate is selected from the group consisting of LC (Alumina Filled PI) and LX (Alumina Filled PI), used in conjunction with an aluminum alloy composition substrate.

5 . The laminate of claim 1 wherein the laminate is LU (Anodized aluminum with adhesive)

6 . The laminate of claim 1 wherein the composition of the first metal layer is aluminum.

7 . The laminate of claim 1 wherein the composition of the first metal layer is copper.

8 . The laminate of claim 6 or claim 7 wherein the laminate Thickness is from about 125 microns to about 3 millimeters.

9 . The laminate of claim 1 wherein the laminate is a CooLam™ laminate and the metal is Aluminum Alloy 5005.

10 . The laminate of claim 1 used for LED mounting and Interconnection.

11 . The laminate of claim 10 wherein the laminate is used in uses selected from the group consisting of luminaires, lamps, signs, displays and stage lighting.

12 . The laminate of claim 1 wherein the copper layer is at 18 um, dielectric is at 6 um and aluminum is at 100 um.

13 . The laminate of claim 1 wherein the copper is at 35 um, dielectric is at 12 um and aluminum is at 200 um to 247 um thickness.

14 . A “Metal Core Printed Circuit Board” made with the laminate of claim 1 .

15 . The laminate of claim 6 wherein the aluminum is anodized.

16 . The laminate of claim 6 wherein the aluminum is treated with a chemical conversion coating.