IP Library Granted Patent US 8,377,623
Granted Patent B2
US 8,377,623 · App. 12/745,036 · Granted Feb 19, 2013

Photocurable resin composition for producing three dimensional articles having high clarity

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,377,623
App. No.
12/745,036
Granted
Feb 19, 2013
Kind
B2
Abstract

The present invention provides a low viscosity photocurable composition including (i) a cationically curable component comprising a polyglycidyl epoxy compound (ii) a free radically active component (iii) a cationic photoinitiator (v) a free radical photoinitiator and optionally (iv) one or more optional components. The photocurable composition can be cured using rapid prototyping techniques to form clear, colorless three-dimensional articles having excellent mechanical properties.

Claims (53)

1. A photocurable composition comprising:

(a) 35-80% by weight of a cationically curable component comprising a polyglycidyl epoxy compound;

(b) 15-60% by weight of a free radically active component comprising an ethoxylated and/or propoxylated poly(meth)acrylate;

(c) 0.1-10% by weight of an antimony-free cationic photoinitiator;

(d) 0.01-10% by weight of a free radical photoinitiator; and

(e) 0-40% by weight of one or more optional components wherein the percent by weight is based on the total weight of the photocurable composition, wherein the photocurable composition has no antimony content, wherein the cationically curable component and free radically active component produce a C:H:O ratio of at least 3.0:3.75:1, and wherein the photocurable composition, after cure, is clear and has a yellowness index/inch thickness of less than 70 and a flexural modulus of at least 1000 MPa.

2. The photocurable composition of claim 1 wherein the C:H:O ratio is at least 3.5:5.0:1.

3. The photocurable composition of claim 1 wherein the free radically active component further comprises a non-aromatic poly(meth)acrylate.

4. The photocurable composition of claim 3 wherein the poly(meth)acrylate is an alicyclic poly(meth)acrylate.

5. The photocurable composition of claim 1 wherein the antimony-free cationic photoinitiator is of the formula (I):

where

R 1 , R 2 and R 3 are each independently of one another C 6-18 aryl that is unsubstituted or substituted by radicals selected from the group consisting of C 1-6 alkyl; C 1-6 alkoxy; C 1-6 alkylthio; halogen; amino groups; cyano groups;

nitro groups, and arylthio;

Q is boron or phosphorus;

X is a halogen atom; and

m is an integer corresponding to the valence of Q plus 1.

6. The photocurable composition of claim 1 wherein the polyglycidyl epoxy compound comprises a hydrogenated bisphenol epoxy-containing compound.

7. The photocurable composition of claim 6 wherein the cationically curable component further comprises an oxetane compound.

8. The photocurable composition of claim 1 wherein the cationic photoinitiator is a triarylsulfonium hexafluorophosphate salt.

9. A photocurable composition comprising:

(a) 35-80% by weight of a cationically curable component comprising one or more epoxy-containing compounds and one or more oxetane compounds;

(b) 15-60% by weight of a free radically active component comprising

(i) at least one ethoxylated or propoxylated poly(meth)acrylate or mixture thereof and

(ii) a non-aromatic poly(meth)acrylate;

(c) 0.1-10% by weight of an antimony-free cationic photoinitiator;

(d) 0.1-10% by weight of a free radical photoinitiator;

(e) 0-40% by weight of one or more optional components wherein the photocurable composition has no antimony content, wherein the cationically curable component and free radically active component produce a C:H:O ratio of at least 3.0:3.75:1, and wherein the photocurable composition, after cure by exposure to actinic radiation and optionally heat, has a yellowness index/inch thickness of less than 70.

10. The photocurable composition of claim 9 wherein the C:H:O ratio is at least 3.5:5.0:1.

11. The photocurable composition of claim 9 wherein the cationically curable component comprises a hydrogenated bisphenol epoxy-containing compound.

12. A process for producing a colorless three dimensional article comprising:

(a) forming a first layer of the photocurable composition of claim 1 on a surface;

(b) exposing the layer imagewise to actinic radiation to form an imaged cross-section, wherein the radiation is of sufficient intensity to cause substantial curing of the layer in the exposed areas;

(c) forming a second layer of the composition of claim 1 on the previously exposed imaged cross-section;

(d) exposing the second layer from step (c) imagewise to actinic radiation to form an additional imaged cross-section, wherein the radiation is of sufficient intensity to cause substantial curing of the second layer in the exposed areas and to cause adhesion to the previously exposed imaged cross-section; and

(e) repeating steps (c) and (d) a sufficient number of times in order to build up the three-dimensional article.

13. A three-dimensional medical article produced according to the process of claim 12 .

14. A three-dimensional article produced according to the process of claim 12 wherein the article is a container, headlight, shade or decorative object.

15. A process for producing a three dimensional article by jet printing comprising the steps of:

(a) applying successive droplets of the photocurable composition of claim 1 at targeted locations on a substrate in accordance with a desired shape stored on a computer file;

(b) exposing the droplets to electromagnetic radiation to cure the droplets in the exposed areas;

(c) repeating steps (a) and (b) a sufficient number of times in order to build up the three dimensional article.

16. The process of claim 15 wherein the substrate comprises paper, textiles, tiles, printing plates, wallpaper, plastic, powder or paste.

17. The process of claim 16 wherein the photocurable composition is exposed to electromagnetic radiation pixel by pixel, line by line, layer by layer, after several layers have been formed, and/or after all layers have been formed.

18. The process of claim 17 wherein the electromagnetic radiation employed is UV light, microwave radiation, visible light, or laser beams.

19. A photocurable composition comprising:

(a) 35-80% by weight of a cationically curable component comprising a hydrogenated aromatic polyglycidyl epoxy compound;

(b) 15-60% by weight of a free radically active component comprising an ethoxylated and/or propoxylated poly(meth)acrylate;

(c) 0.1-10% by weight of an antimony-free cationic photoinitiator;

(d) 0.01-10% by weight of a free radical photoinitiator; and

(e) 0-40% by weight of one or more optional components

(f) 5-25% of an oxetane compound having one oxetane ring wherein the percent by weight is based on the total weight of the photocurable composition, wherein the photocurable composition has no antimony content, and wherein the photocurable composition has a C:H:O ratio of at least 3.0:3.75:1 and after cure, is clear and has a yellowness index/inch thickness of less than 70 and a flexural modulus of at least 1000 MPa.

20. The photocurable composition of claim 19 wherein the C:H:O ratio is at least 3.5:5.0:1.

21. The photocurable composition of claim 9 wherein the amount of the ethoxylated or propoxylated poly(meth)acrylate or mixture thereof is greater than 40% by weight of the total amount of free radically active component.

Assignments (6)
RELEASE OF SECURITY INTEREST Recorded Aug 26, 2021
From: HSBC BANK USA, NATIONAL ASSOCIATION
To: 3D SYSTEMS, INC.
Reel/Frame 057651/0374 →
SECURITY INTEREST Recorded Feb 27, 2019
From: 3D SYSTEMS, INC.
To: HSBC BANK USA, NATIONAL ASSOCIATION, AS ADMINISTRATIVE AGENT
Reel/Frame 048456/0017 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 27, 2012
From: HUNTSMAN ADVANCED MATERIALS AMERICAS LLC
To: HUNTSMAN INTERNATIONAL LLC
Reel/Frame 029355/0946 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 27, 2012
From: HUTNSMAN INTERNATIONAL LLC
To: 3D SYSTEMS, INC.
Reel/Frame 029356/0004 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 14, 2012
From: HUNTSMAN INTERNATIONAL LLC
To: 3D SYSTEMS, INC.
Reel/Frame 027861/0128 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 27, 2010
From: FONG, JOHN WAL
To: HUNTSMAN ADVANCED MATERIALS AMERICAS LLC
Reel/Frame 024484/0227 →