MEMS package and method for the production thereof

1. An MEMS package

comprising at least one chip having MEMS structures and at least one electrical connection pad on its top side,

comprising a covering plate having side edges and a modulus of elasticity of at least 20 GPa,

comprising a frame structure, which comprises a polymer and the material of which has a modulus of elasticity of at most 5 GPa and which is arranged between the chip and the covering plate in such a way that a closed cavity which receives the MEMS structures is formed,

comprising solderable or bondable electrical contacts arranged on the outer side of the covering plate which faces away from the chip,

comprising an electrical connection structure, which electrically conductively connects the at least one connection pad to the contacts,

wherein the connection structure is led around the side edges of the covering plate,

wherein, at at least one side of the MEMS package, the edge of the covering plate is drawn back relative to the edge of the chip,

wherein the connection structures bear at least in part on the top side of the chip and on the outer side of the covering plate, and

wherein the connection structure is made by metallization and includes a conductor track applied on the top side of the chip, the conductor track extending between a respective surface of the chip and the frame structure out of the closed cavity.

2. The MEMS package as claimed in claim 1 , wherein the covering plate comprises at least one layer of a rigid, electrically insulating or semiconducting material selected from glass, ceramic, crystalline or polycrystalline compounds or semiconductors.

3. The MEMS package as claimed in claim 1 , wherein the covering plate consists of the same material as the chip.

4. The MEMS package as claimed in claim 1 , wherein the frame structure is constructed from a photopatternable material.

5. The MEMS package as claimed in claim 1 , wherein the connection structures comprise a section which is led through the frame structure.

6. The MEMS package as claimed in claim 1 , wherein chip and covering plate are produced from lithium tantalate.

7. The MEMS package as claimed in claim 1 , wherein the frame structure has a corresponding bent course relative to a top surface of the chip facing the frame structure or relative to a bottom surface of the covering plate facing the frame structure.

8. The MEMS package as claimed in claim 1 , wherein supporting structures are arranged within the cavity enclosed by the frame structure, said supporting structures being supported at the covering plate and the chip.

9. The MEMS package as claimed in claim 1 ,

wherein electrically conductive metallic component structures are arranged on the top side of the chip,

wherein the component structures are covered with a passivation layer.

10. The MEMS package as claimed in claim 9 , wherein the thickness of the passivation is at most 100 nm.

11. The MEMS package as claimed in claim 1 , wherein an inorganic coating which inhibits the diffusion of moisture is applied to the inwardly and/or outwardly facing side area of the frame structure.

12. The MEMS package as claimed in claim 1 , wherein a large-area thermal pad serving for heat dissipation is additionally applied on the outer area of the package which has the contacts.

13. The MEMS package as claimed in claim 12 , wherein the thermal pad is connected to thermal vias led through the chip or through the covering plate.

14. The MEMS package as claimed in claim 1 , wherein the MEMS structures realize components selected from SAW components, FBAR components, micromechanical acceleration sensors, gyro sensors, microphones and pressure sensors.

15. The MEMS package as claimed in claim 1 , wherein the package lacks any electrical contact extending through the frame spacer between the chip and the covering plate.

16. The MEMS package as claimed in claim 1 , wherein the connection structure contacts the side edges of the covering plate as the connection structure is led around the side edges thereof.