Metal-clad laminate
View Patent ↗The present invention relates to a flexible metal-clad laminate for a printed circuit board and a method of manufacturing the same. The flexible metal-clad laminate includes: a first polyimide layer that is disposed on one surface of the metal-clad and has thermal expansion coefficient of 20 ppm/K or less; and a second polyimide layer that is disposed on one surface of the first polyimide layer and has thermal expansion coefficient of 20 ppm/K or more, wherein a difference between the thermal expansion coefficients of the first and second polyimide layers is within 5 ppm/K and a glass transition temperature T g of resin of the first polyimide layer is 300° C.<T g <350° C., which is lower than a maximum curing temperature.
1. A flexible metal-clad laminate of polyimide formed by coating each of two kinds of polyimide precursor solutions on a conductive metal clad and then performing a heat treatment process at least once, the flexible metal-clad laminate including:
a first polyimide layer that is disposed on one surface of a metal clad and has thermal expansion coefficient of 20 ppm/K or less, wherein a glass transition temperature T g of the first polyimide layer is 300° C.≦T g ≦350° C., which is lower than a maximum curing temperature; and
a second polyimide layer that is disposed on one surface of the first polyimide layer and has thermal expansion coefficient of 20 ppm/K or more,
wherein a difference between the thermal expansion coefficients of the first and second polyimide layers is 5 ppm/K or less, and
wherein the heat treatment temperature is 20 to 40° C. higher than the glass transition temperature T g of the first polyimide layer, once or more during the heat treatment process.
2. The flexible metal-clad laminate as set forth in claim 1 , wherein a thickness ratio of the first polyimide resin layer and the second polyimide resin layer is 1:100 to 1:0.01.
3. The flexible metal-clad laminate as set forth in claim 1 , wherein the used metal clad is selected from a group consisting of copper, aluminum, silver, palladium, nickel, chrome, molybdenum, tungsten and a mixture thereof and an alloy thereof.