IP Library Granted Patent US 8,638,160
Granted Patent B2
US 8,638,160 · App. 12/746,712 · Granted Jan 28, 2014

Integrated circuit and semiconductor device

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Quick Facts
Patent No.
US 8,638,160
App. No.
12/746,712
Granted
Jan 28, 2014
Kind
B2
Abstract

An integrated circuit ( 100 ) in which a voltage divider circuit is integrated comprises a first resistor ( 121 ), second resistor ( 122 ), control portion ( 130 ), switch ( 140 ), and switching portion ( 150 ). The first resistor ( 121 ) and second resistor ( 122 ) form a resistive voltage divider element for dividing a voltage obtained by rectifying an alternating-current voltage, or a direct-current voltage, supplied to a control portion ( 130 ). The switch ( 140 ) is provided in series with the resistive voltage divider element, and passes or cuts off current passing through the resistive voltage divider element. The switching portion ( 150 ) switches the switch ( 140 ) so as to pass current during driving of the control portion ( 130 ), and cut off current during standby of the control portion ( 130 ).

Claims (12)

1. An integrated circuit, comprising a voltage divider circuit, having:

a resistive voltage divider element for dividing a voltage between ground and a high-voltage line which supplies a voltage obtained by rectifying an alternating-current voltage or a direct-current voltage;

a switch which is connected in series to the resistive voltage divider element and which cuts off a current path formed between the high-voltage line and ground via the resistive voltage divider element; and

switching means for opening and closing the switch according to the state of a semiconductor device which is a supply destination of the voltage obtained by division by the resistive voltage divider element,

the voltage divider circuit being formed on the same semiconductor substrate as the semiconductor device

wherein the switch is a MOSFET and wherein a portion or the entirety of the resistive voltage divider element, the MOSFET, and a JFET are integrated on the same semiconductor substrate.

2. The integrated circuit according to claim 1 , characterized in that the resistive voltage divider element has a resistance adjustment portion which adjusts a voltage division ratio of the resistive voltage divider element.

3. The integrated circuit according to claim 2 , characterized in that the resistive voltage divider element of the portion in which the resistance adjustment portion is formed is connected to a source terminal of the MOSFET.

4. The integrated circuit according to claim 1 , characterized in that a drain terminal of the JFET and a high-potential side of the resistive voltage divider element connected to a drain terminal of the MOSFET are connected to an external connection terminal connected to the high-voltage line.

5. The integrated circuit according to claim 4 , characterized in that the drain terminal of the JFET and the high-potential side of the resistive voltage divider element connected to the drain terminal of the MOSFET are connected to the same external connection terminal.

6. The integrated circuit according to claim 1 , characterized in that a high-potential side of the resistive voltage divider element connected to a drain terminal of the JFET and a drain terminal of the MOSFET is connected to an external connection terminal connected to the high-voltage line.

7. The integrated circuit according to claim 1 , characterized in that it is a control IC of a switching power supply.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 9, 2012
From: KARINO, TAICHI; KITAMURA, AKIO; SUGAWARA, TAKATO
To: FUJI ELECTRIC SYSTEMS CO., LTD.
Reel/Frame 027833/0954 →
MERGER AND CHANGE OF NAME Recorded Aug 26, 2011
From: FUJI ELECTRIC SYSTEMS CO., LTD. (FES); FUJI TECHNOSURVEY CO., LTD. (MERGER BY ABSORPTION)
To: FUJI ELECTRIC CO., LTD.
Reel/Frame 026970/0872 →