LAMINATE, METHOD FOR PRODUCING LAMINATE, FLEXIBLE PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD
An object of the present invention is to improve, in a laminate and a flexible printed circuit board obtained using the laminate, (i) adhesiveness between a resin material and a plating layer and (ii) soldering heat resistance after moisture absorption. This object is attained by a method for producing a laminate including at least a polymer film, a to-be-plated layer containing at least a crystalline thermoplastic resin, and a plating layer, said method including the steps of: A) applying plating to a resin material including at least a polymer film and a to-be-plated layer containing at least a crystalline thermoplastic resin, in order to produce a laminate including at least the polymer film, the to-be-plated layer containing at least the crystalline thermoplastic resin, and a plating layer: and B) heating the laminate.
1 . A laminate comprising at least:
a polymer film;
a to-be-plated layer containing at least a crystalline thermoplastic resin; and
a plating layer.
2 . A method for producing a laminate including at least a polymer film, a to-be-plated layer containing at least a crystalline thermoplastic resin, and a plating layer,
said method comprising the steps of:
A) applying plating to a resin material including at least a polymer film and a to-be-plated layer containing at least a crystalline thermoplastic resin, in order to produce a laminate including at least the polymer film, the to-be-plated layer containing at least the crystalline thermoplastic resin, and a plating layer; and
B) heating the laminate.
3 . The method as set forth in claim 2 , wherein:
the step A) is performed at least by means of electroless plating; and
the step B) is performed just after the electroless plating.
4 . The method as set forth in claim 2 , further comprising the step of:
C) forming a through-hole through the resin material including at least the polymer film and the to-be-plated layer containing at least the crystalline thermoplastic resin,
the step C) being performed before the step A).
5 . The method as set forth in claim 2 , further comprising the step of:
D) performing a desmear treatment on the resin material including at least the polymer film and the to-be-plated layer containing at least the crystalline thermoplastic resin,
the step D) being performed before the step A).
6 . The method as set forth in claim 2 , wherein:
in the step B), the laminate is heated at a temperature in a range from a temperature lower by 100° C. than a glass transition temperature of the crystalline thermoplastic resin to a temperature higher by 200° C. than the glass transition temperature.
7 . The method as set forth in claim 2 , wherein:
the crystalline thermoplastic resin is crystalline thermoplastic polyimide.
8 . A laminate comprising at least:
a polymer film;
a to-be-plated layer containing at least a crystalline thermoplastic resin; and
a plating layer,
a strength ratio Y/X being below 2.0, where X is a peel strength of the plating layer of the laminate and Y is a peel strength of the plating layer measured after the laminated is heated at 230° C. for 30 minutes.
9 . A method for manufacturing a flexible printed circuit board, comprising the step of:
using a laminate obtained through a method as set forth in claim 2 .
10 . A flexible printed circuit board manufactured with use of a laminate as set forth in claim 1 .
11 . A flexible printed circuit board manufactured with use of a laminate as set forth in claim 8 .