METHOD AND SYSTEM FOR A LEAKY WAVE ANTENNA ON AN INTEGRATED CIRCUIT PACKAGE
Methods and systems for a leaky wave antenna LWA on an integrated circuit (IC) package are disclosed and may include communicating RF signals using one or more LWAs in a wireless device. The LWAs may be integrated in metal layers in an IC package, and a resonant frequency of the LWAs may be dependent on cavity heights associated with the metal layers. The cavity heights may be configured utilizing micro-electro-mechanical systems deflection. The RF signals may include 60 GHz signals. The LWAs may include microstrip and/or coplanar waveguides where a cavity height of the LWAs may be dependent on a spacing between conductive lines in the waveguides. The LWAs may be configured to transmit the wireless signals at a desired angle from a surface of the IC package. The IC package may be affixed to a printed circuit board, and an IC may be flip-chip-bonded to the IC package.
1 . A method for communication, the method comprising:
communicating RF signals using one or more leaky wave antennas in a wireless device, wherein:
said one or more leaky wave antennas are integrated in metal layers in an integrated circuit package; and
a resonant frequency of said one or more leaky wave antennas is dependent on one or more cavity heights that is associated with said metal layers.
2 . The method according to claim 1 , comprising configuring at least a portion of said one or more cavity heights utilizing micro-electro-mechanical systems (MEMS) deflection.
3 . The method according to claim 1 , comprising configuring at least a portion of said one or more cavity heights utilizing micro-electro-mechanical systems (MEMS) deflection.
4 . The method according to claim 1 , wherein said leaky wave antennas comprise microstrip waveguides.
5 . The method according to claim 4 , wherein a cavity height of said leaky wave antennas is dependent on a spacing between conductive lines in said microstrip waveguides.
6 . The method according to claim 1 , wherein said leaky wave antennas comprise coplanar waveguides.
7 . The method according to claim 6 , wherein a cavity height of said leaky wave antennas is dependent on a spacing between conductive lines in said coplanar waveguides.
8 . The method according to claim 1 , comprising configuring said leaky wave antennas to transmit said wireless signals at a desired angle from a surface of said integrated circuit package.
9 . The method according to claim 1 , wherein said integrated circuit package is affixed to a printed circuit board.
10 . The method according to claim 1 , wherein an integrated circuit is flip-chip-bonded to said integrated circuit package.
11 . A system for enabling communication, the system comprising:
an integrated circuit package for use in a wireless device, said integrated circuit package comprising one or more leaky wave antennas, wherein:
said one or more leaky wave antennas are integrated in metal layers in an integrated circuit package; and
a resonant frequency of said one or more leaky wave antennas is dependent on one or more cavity heights that is associated with said metal layers.
12 . The system according to claim 11 , wherein said wireless device is operable to configure at least a portion of said one or more cavity heights utilizing micro-electro-mechanical systems (MEMS) deflection.
13 . The system according to claim 11 , wherein said wireless device is operable to configure at least a portion of said one or more cavity heights utilizing micro-electro-mechanical systems (MEMS) deflection.
14 . The system according to claim 11 , wherein said leaky wave antennas comprise microstrip waveguides.
15 . The system according to claim 14 , wherein a cavity height of said leaky wave antennas is dependent on a spacing between conductive lines in said microstrip waveguides.
16 . The system according to claim 11 , wherein said leaky wave antennas comprise coplanar waveguides.
17 . The system according to claim 16 , wherein a cavity height of said leaky wave antennas is dependent on a spacing between conductive lines in said coplanar waveguides.
18 . The system according to claim 11 , wherein said wireless device is operable to configure said leaky wave antennas to transmit said wireless signals at a desired angle from a surface of said integrated circuit package.
19 . The system according to claim 11 , wherein said integrated circuit package is affixed to a printed circuit board.
20 . The system according to claim 11 , wherein an integrated circuit is flip-chip-bonded to said integrated circuit package.