METHOD AND SYSTEM FOR COMMUNICATING VIA LEAKY WAVE ANTENNAS WITHIN A FLIP-CHIP BONDED STRUCTURE
Methods and systems for communicating via leaky wave antennas (LWAs) within a flip-chip bonded structure are disclosed and may include communicating RF signals in a wireless device including one or more LWAs between a plurality of support structures, the structures being coupled via flip-chip bonding. Low-frequency signals may be communicated via flip-chip bonding contacts. The RF signals may be communicated perpendicular to a surface and/or at a desired angle from the surface of the structures, which may include at least one of: an integrated circuit, an integrated circuit package, and a printed circuit board. The LWAs may include microstrip and/or coplanar waveguides where a cavity height of the LWAs may be configured by controlling spacing between conductive lines in the waveguides. The low-frequency signals may include DC bias voltages. The RF signals may be communicated from a single LWA to a plurality of LWAs.
1 . A method for communication, the method comprising:
in a wireless device comprising one or more leaky wave antennas integrated within and/or on a plurality of support structures, said support structures being coupled via flip-chip-bonding:
communicating RF signals between said support structures via said one or more integrated leaky wave antennas; and
communicating low-frequency signals via contacts defined via said flip-chip bonding.
2 . The method according to claim 1 , comprising communicating said RF signals between said support structures perpendicular to a surface of said support structures.
3 . The method according to claim 1 , comprising configuring said leaky wave antennas to transmit said RF signals at a desired angle from said surface of said support structures.
4 . The method according to claim 1 , wherein said support structures comprise at least one of: an integrated circuit, an integrated circuit package, and a printed circuit board.
5 . The method according to claim 1 , wherein said leaky wave antennas comprise microstrip waveguides.
6 . The method according to claim 5 , comprising configuring a cavity height of said leaky wave antennas by controlling spacing between conductive lines in said microstrip waveguides.
7 . The method according to claim 1 , wherein said leaky wave antennas comprise coplanar waveguides.
8 . The method according to claim 7 , comprising configuring a cavity height of said leaky wave antennas by controlling spacing between conductive lines in said coplanar waveguides.
9 . The method according to claim 1 , wherein said low-frequency signals comprise DC bias voltages.
10 . The method according to claim 1 , comprising communicating said RF signals from a single leaky wave antenna to a plurality of leaky wave antennas.
11 . A system for enabling communication, the system comprising:
one or more circuits for use in a wireless device comprising one or more leaky wave antennas integrated within and/or on a plurality of support structures, said support structures being coupled via flip-chip-bonding, wherein said one or more circuits are operable to:
communicate RF signals between said support structures via said one or more integrated leaky wave antennas; and
communicate low-frequency signals via contacts defined via said flip-chip bonding.
12 . The system according to claim 11 , wherein said one or more circuits are operable to communicate said RF signals between said support structures perpendicular to a surface of said support structures.
13 . The system according to claim 11 , wherein said one or more circuits are operable to configure said leaky wave antennas to transmit said RF signals at a desired angle from said surface of said support structures.
14 . The system according to claim 11 , wherein said support structures comprise at least one of: an integrated circuit, an integrated circuit package, and a printed circuit board.
15 . The system according to claim 11 , wherein said leaky wave antennas comprise microstrip waveguides.
16 . The system according to claim 15 , wherein said one or more circuits are operable to configure a cavity height of said leaky wave antennas by controlling spacing between conductive lines in said microstrip waveguides.
17 . The system according to claim 11 , wherein said leaky wave antennas comprise coplanar waveguides.
18 . The system according to claim 17 , wherein said one or more circuits are operable to configure a cavity height of said leaky wave antennas by controlling spacing between conductive lines in said coplanar waveguides.
19 . The system according to claim 11 , wherein said low-frequency signals comprise DC bias voltages.
20 . The system according to claim 11 , wherein said one or more circuits are operable to communicate said RF signals from a single leaky wave antenna to a plurality of leaky wave antennas.