METHOD AND SYSTEM FOR AN ON-CHIP LEAKY WAVE ANTENNA
Methods and systems for an on-chip leaky wave antenna (LWA) are disclosed and may include communicating RF signals using one or more LWAs in a wireless device. The LWAs may be integrated in metal layers in an integrated circuit (chip) in the wireless device. The RF signals may be communicated to devices external to the chip via a desired angle from the surface of the chip, or may be communicated between regions within the chip. The LWAs may comprise microstrip waveguides where a cavity height of the LWAs may be controlled by configuring a spacing between conductive lines in the microstrip waveguides. The LWAs may include coplanar waveguides where a cavity height of the leaky wave antennas may be controlled by configuring a spacing between conductive lines in the coplanar waveguides. The chip may be flip-chip-bonded to an integrated circuit package which may be affixed to a printed circuit board.
1 . A method for communication, the method comprising:
communicating RF signals via one or more leaky wave antennas in a wireless device, wherein said one or more leaky wave antennas are integrated in metal layers in an integrated circuit in said wireless device.
2 . The method according to claim 1 , comprising communicating said RF signals to devices external to said integrated circuit via a surface of said integrated circuit.
3 . The method according to claim 2 , comprising configuring said leaky wave antennas to transmit said wireless signals at a desired angle from said surface of said integrated circuit.
4 . The method according to claim 1 , comprising communicating said RF signals between regions within said integrated circuit.
5 . The method according to claim 1 , wherein said leaky wave antennas comprise microstrip waveguides.
6 . The method according to claim 5 , comprising configuring a cavity height of said leaky wave antennas by controlling spacing between conductive lines in said microstrip waveguides.
7 . The method according to claim 1 , wherein said leaky wave antennas comprise coplanar waveguides.
8 . The method according to claim 7 , comprising configuring a cavity height of said leaky wave antennas by controlling spacing between conductive lines in said coplanar waveguides.
9 . The method according to claim 1 , wherein said integrated circuit is flip-chip-bonded to an integrated circuit package.
10 . The method according to claim 9 , wherein said integrated circuit package is affixed to a printed circuit board.
11 . A system for enabling communication, the system comprising:
one or more circuits in an integrated circuit for use in a wireless device, said integrated circuit comprising one or more leaky wave antennas, wherein:
said one or more leaky wave antennas are integrated in metal layers in said integrated circuit; and
said one or more circuits are operable to communicate RF signals via said one or more leaky wave antennas in said integrated circuit.
12 . The system according to claim 11 , wherein said one or more circuits are operable to communicate said RF signals to devices external to said integrated circuit via a surface of said integrated circuit.
13 . The system according to claim 12 , wherein said one or more circuits are operable to configure said leaky wave antennas to transmit said wireless signals at a desired angle from said surface of said integrated circuit.
14 . The system according to claim 11 , wherein said one or more circuits are operable to communicate said RF signals between regions within said integrated circuit.
15 . The system according to claim 11 , wherein said leaky wave antennas comprise microstrip waveguides.
16 . The system according to claim 15 , wherein said one or more circuits are operable to configure a cavity height of said leaky wave antennas by controlling a spacing between conductive lines in said microstrip waveguides.
17 . The system according to claim 11 , wherein said leaky wave antennas comprise coplanar waveguides.
18 . The system according to claim 17 , wherein said one or more circuits are operable to configure a cavity height of said leaky wave antennas by controlling a spacing between conductive lines in said coplanar waveguides.
19 . The system according to claim 11 , wherein said integrated circuit is flip-chip-bonded to an integrated circuit package.
20 . The system according to claim 19 , wherein said integrated circuit package is affixed to a printed circuit board.