IP Library Granted Patent US 8,787,997
Granted Patent B2
US 8,787,997 · App. 12/751,782 · Granted Jul 22, 2014

Method and system for a distributed leaky wave antenna

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Quick Facts
Patent No.
US 8,787,997
App. No.
12/751,782
Granted
Jul 22, 2014
Kind
B2
Abstract

Methods and systems for a distributed leaky wave antenna (LWA) are disclosed and may include communicating RF signals at one or more frequencies via distributed LWAs in a wireless communication device. The distributed LWAs may be integrated in one or more multi-layer support structures. The RF signals may be communicated at the one or more frequencies via a plurality of cavity heights in the distributed LWAs or via a plurality of sections of the distributed LWAs with different partially reflective surfaces. The distributed LWAs may be configured to transmit the RF signals at a desired angle from a surface of the multi-layer support structures. The distributed LWAs may include microstrip or coplanar waveguides where the plurality of cavity heights of the one or more distributed LWAs may be configured based on distances between conductive lines in the waveguides.

Claims (26)

1. A method for communication, the method comprising:

communicating RF signals at one or more frequencies via one or more distributed leaky wave antennas in a wireless communication device, wherein said one or more distributed leaky wave antennas are integrated in one or more multi-layer support structures in said wireless device; and

adjusting a cavity height of at least one of said one or more distributed leaky wave antennas by causing a deflection of at least one reflective surface of the at least one of said one or more distributed leaky wave antennas to cause the at least one of said one or more distributed leaky wave antennas to transmit at least one of said RF signals in a plane of at least one of said one or more multi-layer support structures.

2. The method according to claim 1 , comprising communicating said RF signals at said one or more frequencies via a plurality of cavity heights in said one or more distributed leaky wave antennas.

3. The method according to claim 1 , comprising communicating said RF signals at said one or more frequencies via a plurality of sections of said one or more distributed leaky wave antennas with different partially reflective surfaces.

4. The method according to claim 1 , wherein said one or more multi-layer support structures comprise one or more of: an integrated circuit, an integrated circuit package, and a printed circuit board.

5. The method according to claim 1 , comprising configuring said one or more distributed leaky wave antennas to transmit said RF signals at a desired angle from a surface of said one or more multi-layer support structures.

6. The method according to claim 1 , wherein said one or more distributed leaky wave antennas comprise microstrip waveguides.

7. The method according to claim 6 , comprising controlling said plurality of cavity heights of said one or more distributed leaky wave antennas by adjusting distances between conductive lines in said microstrip waveguides.

8. The method according to claim 1 , wherein said one or more distributed leaky wave antennas comprise coplanar waveguides.

9. The method according to claim 8 , comprising controlling said plurality of cavity heights of said one or more distributed leaky wave antennas by adjusting distances between conductive lines in said coplanar waveguides.

10. The method according to claim 1 , comprising configuring a beam shape of said communicated RF signals by tuning a frequency of a signal communicated to said one or more distributed leaky wave antennas.

11. A system for enabling communication, the system comprising:

one or more circuits disposed in a wireless device comprising one or more distributed leaky wave antennas,

wherein said one or more leaky wave antennas are integrated in one or more multi-layer support structures in said wireless device, and

the one or more circuits are further configured to adjust a cavity height of at least one of said one or more distributed leaky wave antennas by causing a deflection of at least one reflective surface of the at least one of said one or more distributed leaky wave antennas to cause the at least one of said one or more distributed leaky wave antennas to transmit RF signals in a plane of at least one of said one or more multi-layer support structures; and

said one or more circuits are operable to communicate said RF signals at one or more frequencies via said one or more distributed leaky wave antennas.

12. The system according to claim 11 , wherein said one or more circuits are operable to communicate said RF signals at said one or more frequencies via a plurality of cavity heights in said one or more distributed leaky wave antennas.

13. The system according to claim 11 , wherein said one or more circuits are operable to communicate said RF signals at said one or more frequencies via a plurality of sections of said one or more distributed leaky wave antennas with different partially reflective surfaces.

14. The system according to claim 11 , wherein said one or more multi-layer support structures comprise one or more of: an integrated circuit, an integrated circuit package, and a printed circuit board.

15. The system according to claim 11 , wherein said one or more circuits are operable to configure said one or more distributed leaky wave antennas to transmit said RF signals at a desired angle from a surface of said one or more multi-layer support structures.

16. The system according to claim 11 , wherein said one or more distributed leaky wave antennas comprise microstrip waveguides.

17. The system according to claim 16 , wherein said one or more circuits are operable to control said plurality of cavity heights of said one or more distributed leaky wave antennas by adjusting distances between conductive lines in said microstrip waveguides.

18. The system according to claim 11 , wherein said one or more distributed leaky wave antennas comprise coplanar waveguides.

19. The system according to claim 18 , wherein said one or more circuits is operable to control said plurality of cavity heights of said one or more distributed leaky wave antennas by adjusting distances between conductive lines in said coplanar waveguides.

20. The system according to claim 19 , wherein said one or more circuits are operable to configure a beam shape of said communicated RF signals by tuning a frequency of a signal communicated to said one or more distributed leaky wave antennas.

Assignments (7)
CORRECTIVE ASSIGNMENT TO CORRECT THE ERROR IN RECORDING THE MERGER IN THE INCORRECT US PATENT NO. 8,876,094 PREVIOUSLY RECORDED ON REEL 047351 FRAME 0384. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Mar 8, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 049248/0558 →
CORRECTIVE ASSIGNMENT TO CORRECT THE EFFECTIVE DATE OF THE MERGER PREVIOUSLY RECORDED AT REEL: 047230 FRAME: 0910. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Oct 29, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047351/0384 →
MERGER Recorded Oct 4, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047230/0910 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: BROADCOM CORPORATION
Reel/Frame 041712/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 1, 2017
From: BROADCOM CORPORATION
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041706/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: BROADCOM CORPORATION
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037806/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 23, 2010
From: ROFOUGARAN, AHMADREZA; ROFOUGARAN, MARYAM
To: BROADCOM CORPORATION
Reel/Frame 024871/0252 →