IP Library Granted Patent US 8,399,311
Granted Patent B2
US 8,399,311 · App. 12/753,615 · Granted Mar 19, 2013

Thin film transistor array panel and method of manufacture

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Quick Facts
Patent No.
US 8,399,311
App. No.
12/753,615
Granted
Mar 19, 2013
Kind
B2
Abstract

A thin film transistor array panel includes a gate line formed on a substrate, an interlayer insulating film formed on the gate line and having an opening, a gate insulator formed in the opening, a data line formed on the interlayer insulating film and including a first conductive layer made of a transparent conductive oxide and a second conductive layer made of a metal, a source electrode connected to the data line and made of a transparent conductive oxide, a drain electrode facing the source electrode and made of a transparent conductive oxide, a pixel electrode connected to the drain electrode, and an organic semiconductor contacting the source electrode and the drain electrode.

Claims (33)

1. A method for manufacturing a thin film transistor array panel, comprising:

forming a gate line on a substrate;

forming an interlayer insulating film on the entire surface of the substrate including the gate line;

forming an opening in the interlayer insulating film;

forming a gate insulator in the opening;

sequentially forming a first conductive layer comprising a transparent conductive oxide and a second conductive layer comprising a metal on the interlayer insulating film and the gate insulator;

sequentially photo-etching the second conductive layer and the first conductive layer to form a data line and conductive members separate from the data line;

removing part of the data line and the second conductive layer of the conductive members to form a pixel electrode including a drain electrode and a source electrode; and

forming an organic semiconductor contacting the source electrode and the drain electrode.

2. The method of claim 1 , wherein the forming of an opening comprises exposing the interlayer insulating film by using a mask having a shielding region, a transmissive region, and a semi-transmissive region.

3. The method of claim 1 , wherein the forming of a data line and the conductive members and the forming of a pixel electrode and a source electrode are carried out by using one mask.

4. The method of claim 3 , wherein the mask has a shielding region, a transmissive region, and a semi-transmissive region.

5. The method of claim 4 , wherein the forming of a data line and the conductive members comprises:

forming a photoresist film on the second conductive layer;

forming a first photoresist pattern and a second photoresist pattern thinner than the first photoresist pattern by exposing the photoresist film by using the mask; and

etching the second conductive layer and the first conductive layer by using the first photoresist pattern and the second photoresist pattern as a mask.

6. The method of claim 5 , wherein the forming of a pixel electrode and a source electrode comprises:

removing the second photoresist pattern; and

etching the second conductive layer of the conductive members by using the first photoresist pattern as a mask.

7. The method of claim 1 , wherein at least one of the forming of a gate insulator and the forming of an organic semiconductor is carried out by an inkjet printing method.

8. A method for manufacturing a thin film transistor array panel, comprising:

forming a gate line on a substrate;

forming an interlayer insulating film having an opening on the gate line;

forming a gate insulator in the opening;

forming a data line including a source electrode and a pixel electrode including a drain electrode on the interlayer insulating film; and

forming an organic semiconductor on the source electrode and the drain electrode, the gate line being formed by using a first mask, the interlayer insulating film being formed by using a second mask, and

the data line including the source electrode and the pixel electrode including the drain electrode being formed by using a third mask.

9. The method of claim 8 , wherein at least one of the forming of a gate insulator and the forming of an organic semiconductor is carried out by an inkjet printing method.

10. The method of claim 8 , wherein the forming of a data line including a source electrode and a pixel electrode including a drain electrode comprises:

sequentially forming first and second conductive layers that have different etching selectivity ratios;

sequentially etching the second conductive layer and the first conductive layer to expose part of the gate insulator; and

partially etching the second conductive layer,

wherein in the partial etching of the second conductive layer, a portion where the second conductive layer remains is the data line and a portion where the second conductive layer is removed is the source electrode, the drain electrode, and the pixel electrode.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 4, 2026
From: TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
To: LONESTAR CRYSTAL DISPLAY LLC
Reel/Frame 074944/0730 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 21, 2022
From: SAMSUNG DISPLAY CO., LTD.
To: TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
Reel/Frame 060778/0543 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 19, 2012
From: SAMSUNG ELECTRONICS, CO., LTD
To: SAMSUNG DISPLAY CO., LTD
Reel/Frame 028990/0065 →