Semiconductor device and method of manufacturing the same
View Patent ↗There is provided a semiconductor device in which the degradation of electric characteristics can be inhibited. A semiconductor substrate has a main surface, and a trench in the main surface. A buried insulating film is buried in the trench. The trench has one wall surface and the other wall surface which oppose each other. A gate electrode layer is located over at least the buried insulating film. The trench has angular portions which are located between the main surface of at least either one of the one wall surface and the other wall and a bottom portion of the trench.
1. A semiconductor device, comprising:
a semiconductor substrate having a main surface, and a trench in the main surface;
a buried insulating film buried in the trench;
a gate electrode layer located over at least the buried insulating film, and
a gate insulating film located between the gate electrode and the semiconductor substrate,
wherein the trench has one wall portion and an other wall portion which oppose each other, and has an angular portion only between a main surface of the one wall portion and a bottom portion of the trench,
wherein the angular portion is formed at a height lower than the gate insulating film and adjacent an interface between the buried insulating film and the gate insulating film as viewed in cross-section such that the one wall portion of the trench has a stepped shape, and
wherein the buried insulating layer has a stepped shape only on an undersurface of the buried insulating layer.
2. A semiconductor device according to claim 1 ,
wherein a lower portion of the trench from the angular portion to the bottom portion thereof is inclined in cross section with respect to an upper portion of the trench from the angular portion to the main surface.
3. The semiconductor device according to claim 1 , further comprising:
a first region of a first conductivity type formed in the main surface of a portion of the semiconductor substrate located at the one wall portion side of the trench;
a second region formed in the main surface of a portion of the semiconductor substrate located at the other wall portion side of the trench;
a third region of a second conductivity type formed to be located under the first region, and in the main surface of a portion of the semiconductor substrate interposed between the first region and the trench; and
a fourth region of the first conductivity type formed in the semiconductor substrate to be located under the second region and the trench,
wherein the gate electrode layer is located over the third region located in the main surface of the semiconductor substrate, and opposes the fourth region via the buried insulating film.
4. The semiconductor device according to claim 3 , further comprising:
a fifth region of the second conductivity type having an impurity concentration lower than that of the third region, and formed under the third and fourth regions to form a p-n junction with the fourth region.
5. A semiconductor device according to claim 3 ,
wherein the fourth region is formed to extend under the third region,
the semiconductor device further comprising:
a fifth region of the second conductivity type having an impurity concentration lower than that of the third region, and formed under the fourth region; and
a sixth region of the first conductivity type formed between the fourth region and the fifth region, and having an impurity concentration higher than that of the fourth region.
6. A semiconductor device according to claim 3 , wherein the angular portion is formed in a part of the trench to be located between the first region and the second region when viewed in plan view.
7. A semiconductor device according to claim 3 , wherein the angular portion is formed in the entire trench to be located between the first region and the second region when viewed in plan view.
8. The semiconductor device according to claim 1 , wherein the angular portion is formed in an n-type drift region.
9. The semiconductor device according to claim 1 , wherein the trench has a stepped shape only on an undersurface of the buried insulating layer.
10. The semiconductor device according to claim 9 , wherein an upper surface of the buried insulating layer is flat from adjacent an interface between the buried insulating film and the gate insulating film to the other wall portion.