Plasma display panel, and substrate assembly of plasma display panel

1. A method for producing a plasma display panel, comprising the steps of:

(a) mixing MgO crystals with MgF 2 ;

(b) firing the resulting mixture;

(c) pulverizing the fired mixture to obtain powdered MgO crystals to which fluorine is added; and

(d) forming a priming particle-emitting layer on a protective layer, the priming particle-emitting layer containing the powdered MgO crystals to which fluorine is added, the protective layer being included in a front-side substrate assembly that comprises a display electrode and a dielectric layer on a glass substrate.

2. The method according to claim 1 , further comprising before the mixing of the step (a) pulverizing the MgO crystals and MgF 2 into powders respectively.

3. The method according to claim 1 , wherein in the step (a), an amount of MgF 2 relative to the mixture of the MgO crystals and MgF 2 is from 0.003 mol % to 0.1 mol %.

4. The method according to claim 1 , wherein in the step (d), the priming particle-emitting layer is formed by spray-applying a slurry onto the protective layer and drying the slurry through a blow of dry air, the slurry containing the powdered MgO crystals to which the fluorine is added.

5. The method according to claim 1 , wherein in the step (d), the priming particle-emitting layer is formed by screen printing the powdered MgO crystals to which the fluorine is added onto the protective layer.

6. The method according to claim 1 , wherein in the step (d), the priming particle-emitting layer is formed by using a dispenser or an ink-jet system so that a past or a suspension including the powdered MgO crystals to which the fluorine is added is attached onto the protective layer.

7. A method for producing a plasma display panel, comprising the steps of:

preparing a slurry containing powdered MgO crystals to which a halogen element is added in an amount from 1 to 10000 ppm;

spray-applying the slurry onto a protective layer; and

drying the slurry to form a printing particle-emitting layer on the protective layer;

wherein the priming particle-emitting layer contains the powdered MgO crystals to which a halogen element is added in an amount from 1 to 10000 ppm and the protective layer is included in a front-side substrate assembly that comprises a display electrode and a dielectric layer on a glass substrate.

8. A method for producing a plasma display panel, comprising,

screen printing powdered MgO crystals to which a halogen element is added in an amount from 1 to 10000 ppm onto a protective layer to form a priming particle-emitting layer on the protective layer;

wherein the priming particle-emitting layer contains the powdered MgO crystals to which a halogen element is added in an amount from 1 to 10000 ppm and the protective layer is included in a front-side substrate assembly that comprises a display electrode and a dielectric layer on a glass substrate.

9. A method for producing a plasma display panel, comprising:

forming a priming-emitting layer on a protective layer by using a dispenser or an ink-jet system so that a past or a suspension including the powdered MgO crystals to which a halogen element is added in an amount from 1 to 10000 ppm is attached onto the protective layer;

wherein the priming particle-emitting layer contains the powdered MgO crystals to which a halogen element is added in an amount from 1 to 10000 ppm and the protective layer is included in a front-side substrate assembly that comprises a display electrode and a dielectric layer on a glass substrate.

10. The method according to claim 7 , wherein the priming particle-emitting layer is formed on the protective layer and at a part of a display region.

11. The method according to claim 8 , wherein the priming particle-emitting layer is formed on the protective layer and at a part of a display region.

12. The method according to claim 9 , wherein the priming particle-emitting layer is formed on the protective layer and a part of a display region.

13. The method according to claim 7 , wherein the halogen element is fluorine and the amount of fluorine added is from 24 to 440 ppm.

14. The method according to claim 8 , wherein the halogen element is fluorine and the amount of fluorine added is from 24 to 440 ppm.

15. The method according to claim 9 , wherein the halogen element is fluorine and the amount of fluorine added is from 24 to 440 ppm.