Granted Patent B1

US 8,341,826 · App. 12/758,469 · Granted Jan 1, 2013

Abstract

Claims (34)

1. A method for fabricating a magnetic recording transducer comprising:

providing a main pole having a bottom, a top wider than the bottom, and a top bevel;

providing a nonmagnetic gap covering the main pole, a portion of the nonmagnetic gap residing on the top of the main pole;

providing a first seed layer, at least a portion of the first seed layer covering the portion of the nonmagnetic gap on top of the main pole;

removing an additional portion of the nonmagnetic gap not residing on the main pole after the first seed layer is provided;

providing a second seed layer after the portion of the nonmagnetic gap is removed, the second seed layer covering at least the portion of the first seed layer; and

providing a wrap-around shield layer on the second seed layer.

2. The method of claim 1 wherein the step of providing the first seed layer further includes:

precleaning the nonmagnetic gap, the precleaning removing not more than ten Angstroms of the portion of the nonmagnetic gap on the top of the main pole; and

depositing the first seed layer.

3. The method of claim 1 wherein the step of providing the second seed layer further includes:

precleaning the first seed layer, the first seed layer being sufficiently thick that the first seed layer remains a continuous layer after the step of precleaning is completed; and

depositing the second seed layer.

4. The method of claim 1 wherein a total thickness of the first seed layer plus the second seed layer does not exceed one hundred nanometers.

5. The method of claim 1 wherein the first seed layer is at least five nanometers thick.

6. The method of claim 5 wherein the first seed layer is not more than twenty nanometers thick.

7. The method of claim 6 wherein the second seed layer is at least thirty-five and not more than one hundred nanometers thick.

8. The method of claim 1 wherein the magnetic recording transducer further includes a plurality of electrical contacts distal from the main pole and wherein the step of removing the additional portion of the nonmagnetic gap further includes:

providing a mask on the first seed layer, the mask exposing the plurality of electrical contacts and a portion of the main pole;

ion milling the nonmagnetic gap layer after the mask is provided; and

removing the mask.

9. The method of claim 1 wherein the first seed layer includes a first material and the second seed layer includes a second material different from the first material.

10. The method of claim 1 wherein the first seed layer includes a material and the second seed layer includes the material.

11. The method of claim 1 wherein at least one of the first seed layer and the second seed layer includes CoNiFe.

12. The method of claim 1 wherein at least one of the first seed layer and the second seed layer includes NiFe.

13. A method for fabricating a magnetic recording transducer comprising:

providing a main pole having a bottom, a top wider than the bottom, and a top bevel;

providing a nonmagnetic gap covering the main pole, a portion of the nonmagnetic gap residing on the top of the main pole;

precleaning the nonmagnetic gap, the precleaning removing not more than ten Angstroms of the portion of the nonmagnetic gap on the top of the main pole;

depositing a first seed layer, at least a portion of the first seed layer covering the portion of the nonmagnetic gap on top of the main pole, the first seed layer having a first thickness of at least five and not more than twenty nanometers thick;

removing an additional portion of the nonmagnetic gap not residing on the main pole after the first seed layer is provided;

precleaning the first seed layer, the first thickness of the first seed layer being sufficiently large that the first seed layer remains a continuous layer after the step of precleaning the first seed layer is completed; and

depositing the second seed layer after the portion of the nonmagnetic gap is removed and after the step of precleaning the first seed layer, the second seed layer covering at least the portion of the first seed layer and having a second thickness, the first thickness plus the second thickness being not more than one hundred nanometers; and

providing a wrap-around shield layer on the second seed layer.

Assignments (9)