IP Library Granted Patent US 8,804,086
Granted Patent B2
US 8,804,086 · App. 12/758,824 · Granted Aug 12, 2014

Anisotropic conductive film, method of manufacturing the same and display apparatus having the same

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Quick Facts
Patent No.
US 8,804,086
App. No.
12/758,824
Granted
Aug 12, 2014
Kind
B2
Abstract

An anisotropic conductive film includes a first thin film layer including concave portions, conductive balls arranged in the concave portions, insulating balls disposed on and between the conductive balls and each having a diameter smaller than the conductive balls, and a second thin film layer disposed covering the insulating balls. A display apparatus includes a pad part and a driving chip, which are electrically connected by the anisotropic conductive film.

Claims (52)

1. A method of manufacturing an anisotropic conductive film, the method comprising:

providing an insulating first thin film layer and concave portions defined therein;

arranging conductive balls in the concave portions;

arranging insulating balls each having a diameter smaller than the conductive balls, on the first thin film layer and the conductive balls;

providing an insulating second thin film layer spaced apart from the conductive balls, to dispose an entirety of the conductive and insulating balls between the insulating first and second thin film layers; and

exposing the conductive balls from the insulating first and second thin film layers, after the providing the insulating second thin film layer.

2. The method of claim 1 , wherein

the conductive balls comprise yittria stabilized zirconia (Ni-YSZ), and

the insulating balls comprise a polymer.

3. The method of claim 1 , wherein the arranging conductive balls comprises:

arranging the conductive balls on the first thin film layer; and

applying a vibration to the first thin film layer and moving the conductive balls to be arranged in the concave portions.

4. The method of claim 3 , wherein the arranging conductive balls further comprises applying an electric field or a magnetic field to the first thin film layer.

5. The method of claim 1 , wherein

each of the concave portions has a diameter equal to or larger than about 5 micrometers, and

each of the conductive balls has a diameter smaller than about 5 micrometers.

6. The method of claim 1 , wherein the forming a first thin film layer comprises:

preparing a carrier thin layer on which concave-convex portions are disposed; and

coating the first thin film layer on the carrier thin layer along the concave-convex portions.

7. The method of claim 6 , further comprising removing the carrier thin layer.

8. The method of claim 7 , further comprising, prior to removing the carrier thin layer, heating the first thin film layer.

9. The method of claim 6 , wherein the carrier thin layer on which the concave-convex portions are disposed is formed by pressing a raw carrier thin layer with a plate on which protrusions are disposed to respectively correspond to the concave portions.

10. An anisotropic conductive film comprising:

an insulating first thin film layer and concave portions defined therein;

an insulating second thin film layer facing the insulating first thin film layer;

conductive balls in the concave portions, between the insulating first and second thin film layers, and spaced apart from the insulating second thin film layer; and

insulating balls disposed on and between the conductive balls, disposed between the insulating first and second thin film layers, and each having a diameter smaller than the conductive balls,

wherein the insulating first thin film layer exposes a portion of the conductive balls to outside the anisotropic conductive film.

11. The anisotropic conductive film of claim 10 , wherein the insulating balls comprise a polymer.

12. The anisotropic conductive film of claim 10 , wherein the conductive balls comprise yittria stabilized zirconia (Ni-YSZ).

13. The anisotropic conductive film of claim 10 , wherein

each of the concave portions has a diameter equal to or larger than about 5 micrometers, and

each of the conductive balls has a diameter smaller than about 5 micrometers.

14. A display apparatus comprising:

a display panel including a pad part;

a driving chip including a bump corresponding to the pad part; and

an anisotropic conductive film disposed between the pad part and the driving chip, and electrically connecting the pad part to the bump,

wherein the anisotropic conductive film comprises:

an insulating first thin film layer including concave portions;

an insulating second thin film layer facing the insulating first thin film layer;

conductive balls in the concave portions, between the insulating first and second thin film layers, and spaced apart from the insulating second thin film layer; and

insulating balls disposed on and between the conductive balls, disposed between the insulating first and second thin film layers, and each having a diameter smaller than the conductive balls;

wherein

the insulating first thin film layer exposes the conductive balls disposed overlapping both the bump of the driving chip and the pad part of the display panel, to the pad part, and

the conductive balls disposed overlapping both the bump of the driving chip and the pad part of the display panel directly contact both the bump and the pad part.

15. The display apparatus of claim 14 , wherein the insulating balls comprise a polymer.

16. The display apparatus of claim 14 , wherein the conductive balls comprise yittria stabilized zirconia (Ni-YSZ).

17. The display apparatus of claim 16 , wherein the pad part comprises an indium-tin-oxide.

18. The display apparatus of claim 17 , wherein the pad part further comprises at least one metal conductive layer.

19. The display apparatus of claim 14 , wherein

each of the concave portions has a diameter equal to or larger than about 5 micrometers, and

each of the conductive balls has a diameter smaller than about 5 micrometers.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 11, 2012
From: SAMSUNG ELECTRONICS CO., LTD.
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 029151/0055 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 13, 2010
From: JUNG, SUK-WON; KIM, WOONGKWON; KIM, DAECHEOL; YANG, SUNGHOON; HAN, SANG YOUN; CHO, BYEONGHOON; JEONG, KI-HUN; JEON, KYUNG-SOOK; BANG, JUNG SUK
To: SAMSUNG ELECTRONICS CO., LTD
Reel/Frame 024223/0483 →