MEMS sensor, method of manufacturing MEMS sensor, and electronic apparatus
View Patent ↗A MEMS sensor includes: a substrate; a fixed electrode portion formed in the substrate; a movable weight portion formed above the fixed electrode portion via a gap; a movable electrode portion formed in the movable weight portion and disposed so as to face the fixed electrode portion; a supporting portion; and a connecting portion that couples the supporting portion with the movable weight portion and is elastically deformable, wherein the movable weight portion is a stacked structure having conductive layers and an insulating layer, and plugs having a larger specific gravity than the insulating layer are embedded in the insulating layer.
1. A MEMS sensor comprising:
a substrate;
a fixed electrode portion formed the substrate;
a movable weight portion formed above the fixed electrode portion via a gap;
a movable electrode portion formed the movable weight portion and disposed so as to face the fixed electrode portion;
a supporting portion; and
a connecting portion that couples the supporting portion with the movable weight portion and is elastically deformable, wherein
the movable weight portion is a stacked structure having a conductive layer and an insulating layer, and
a plug having a larger specific gravity than the insulating layer is embedded in the insulating layer.
2. The MEMS sensor according to claim 1 ,
the conductive layers are formed in plural numbers, and
the insulating layer is formed between the plurality of conductive layers.
3. The MEMS sensor according to claim 2 ,
the plug is conductive material and formed to penetrate through the insulating layer, and
the conductive layers are connected to each other with the plug.
4. The MEMS sensor according to claim 1 ,
the movable weight portion has a plane including a first direction and a second direction orthogonal to the first direction in a plan view, and
the plug is formed to be line-symmetric with respect to both the first direction and the second direction.
5. The MEMS sensor according to claim 1 ,
the movable weight portion has a through hole that penetrates from an uppermost layer to a lowermost layer, and
the plug is formed close to the through hole.
6. The MEMS sensor according to claim 1 ,
the movable electrode portion is formed by using the conductive layer.
7. The MEMS sensor according to claim 1 ,
the movable electrode portion is covered with the insulating layer.
8. The MEMS sensor according to claim 1 ,
an integrated circuit portion is formed on the substrate by using the stacked structure.
9. The MEMS sensor according to claim 8 ,
the fixed electrode portion is formed by using the material of a gate electrode of a transistor formed in the integrated circuit portion.
10. The MEMS sensor according to claim 1 , further comprising:
a second movable electrode portion having an arm shape and extending from the movable weight portion; and
a second fixed electrode portion having an arm shape, extending from the supporting portion, and disposed so as to face the second movable electrode portion.
11. An electronic apparatus having mounted thereon the MEMS sensor according to claim 1 .