In-line connector stack with testing capability
View Patent ↗Connector assemblies for use with implantable medical devices having easy to assemble contacts are disclosed. The connector assemblies are generally formed by coupling a plurality of ring contacts, sealing rings, and spring contact elements together with at least one holding ring to form a connector having a common bore for receiving a medical lead cable. Contact grooves or spring chambers for positioning the spring contact elements are formed in part by assembling multiple components together. A further aspect is a provision for encasing each connector assembly or stack inside a thermoset layer or a thermoplastic layer before over-molding the same to a sealed housing.
1. A method for manufacturing an in-line connector comprising:
encapsulating an in-line connector stack with an encapsulation layer to form an encapsulated in-line stack, wherein:
the encapsulation layer comprises an elongated body defining a bore having a continuous length, a plurality of slots, and a section of the elongated body that is formed as a continuous integral element in a radial direction;
the in-line connector stack comprises a plurality of seal elements, a plurality of conductive contact elements, and a plurality of canted coil springs in contact with the plurality of conductive contact elements;
sliding the in-line connector stack inside the bore so that at least a portion of the in-line connector stack slides past the section that is continuous in the radial direction; wherein a non-conductive end cap comprising an opening is disposed at each end of the in line connector stack; and
aligning the plurality of conductive contact elements with the plurality of slots on the encapsulation layer; and
wherein each of the plurality of canted coil springs is located in a groove comprising a back wall and two side walls formed from a combination of a conductive material and a non-conductive material.
2. The method of claim 1 , wherein the encapsulation layer seals a plurality of seams formed between adjacent pairs of seal elements and conductive contact elements.
3. The method of claim 1 , wherein the snap fit end cap has an entry annular seal for sealing against a lead cable.
4. The method of claim 1 , wherein the in-line connector stack is placed into the bore through one end of the encapsulation layer.
5. The method of claim 1 , further comprising placing the encapsulated in-line stack into a bore of a pre-formed header.
6. The method of claim 5 , wherein the encapsulated in-line stack is pre-tested prior to placing into the bore of the header.
7. The method of claim 5 , further comprising engaging a snap fit end cap against an end opening of the header to retain the encapsulated in-line stack within the bore of the pre-formed header.
8. The method of claim 7 , wherein the snap fit end cap and the bore of the header exert an axial compressive force on the encapsulated in-line stack.
9. The method of claim 5 , wherein the pre-formed header comprises a plurality of slots.
10. The method of claim 9 , wherein the plurality of slots of the pre-formed header are aligned with the plurality of slots on the encapsulation layer.
11. The method of claim 1 , wherein the encapsulation layer comprises a non-conductive continuous cylindrical body forming a cavity for receiving the plurality of seal elements and conductive contact elements.
12. A connector header assembly comprising a header comprising a bore, an in-line connector stack comprising a plurality of alternating seal elements, a plurality of canted coil springs, and conductive contact elements encapsulated by an encapsulation layer to form an encapsulated in-line stack positioned inside the bore of the header, and a snap fit end cap comprising a bore mechanically engaged to the header to retain the encapsulated in-line stack within the bore of the header, the snap fit end cap and the header define a seam therebetween, and wherein the header comprises a plurality of slots aligned with a plurality of slots formed on the encapsulation layer and wherein the encapsulation layer comprises an elongated body that is continuous along a length and continuous in a radial direction without a seam.
13. The connector header assembly of claim 12 , further comprising a first end cap attached to a first end of the encapsulation layer and a second end cap attached to a second end of the encapsulation layer, said first and second end caps each comprising an opening.
14. The connector header assembly of claim 12 , wherein the encapsulated in-line stack is formed before being placed inside the bore of the header.
15. The connector header assembly of claim 14 , wherein the snap fit end cap and the bore of the header exert an axial compressive force on the encapsulated in-line stack.
16. The connector header assembly of claim 12 , wherein the snap fit end cap comprises an opening for accessing a fastener.
17. The connector header assembly of claim 12 , wherein the encapsulation layer seals a plurality of seams formed between adjacent pairs of seal elements and conductive contact elements.
18. The connector header assembly of claim 12 , further comprising a second bore for receiving a second encapsulated in-line stack.
19. The connector header assembly of claim 12 , further comprising an opening on the header for placing a holding ring therethrough.
20. A method for manufacturing an in-line connector comprising:
forming an encapsulated in-line stack by sliding a plurality of seal elements, springs, and conductive contact elements through a firstend opening of a cylindrical housing comprising a bore, a continuous housing section along a radial direction, and the first end opening and a second end opening, said cylindrical housing further comprising a plurality of slots formed laterally of the first opening;
engaging an end cap to the first end opening of the cylindrical housing;
aligning the plurality of conductive contact elements with the plurality of slots on the cylindrical housing; and
testing the encapsulated stack by applying an electrical signal across at least one of the conductive contact elements.
21. The method of claim 20 , further comprising placing the encapsulated stack into a bore of a pre-formed header.