Electronic assembly
View Patent ↗An electronic assembly includes a first substrate and a second substrate, a hole through the first substrate, the second substrate having a trace with an indentation, an electronic device mounted over the indentation in the trace, and the first substrate is attached to the second substrate such that the electronic device is positioned within the hole through the first substrate.
1. An electronic assembly comprising:
a first substrate, a hole through the first substrate;
a second substrate having a trace, the trace having an indentation;
a bonding film between the first and second substrates, the bonding film having an opening, the bonding film positioned so a gap is formed between the first and second substrates around the opening in the bonding film;
an electronic device being positioned over the indentation in the trace and attached to the trace using an adhesive so that at least some adhesive is within the indentation; and,
an encapsulate, encapsulating the electronic device, the encapsulate at least partially extending into the gap between the first and second substrates;
wherein the trace is plated within the indentation, but with the plating not filling the indentation.
2. The electronic assembly of claim 1 , the electronic device comprising a Light Emitting Diode.
3. The electronic assembly of claim 1 , the encapsulate directly bonded to at least a portion of the second substrate.
4. The electronic assembly of claim 1 , further comprising: a trace on the second substrate, the trace having an indentation that is etched into the trace; and, the electronic device being positioned over the indentation in the trace and attached to the trace using an adhesive so that at least some adhesive is within the indentation.
5. The electronic assembly of claim 1 , the second substrate having a reflective coating, the encapsulate bonded to the reflective coating.
6. The electronic assembly of claim 5 , the reflective coating comprising one of: an ink; solder mask.