IP Library Granted Patent US 8,470,923
Granted Patent B2
US 8,470,923 · App. 12/764,636 · Granted Jun 25, 2013

Composite material for structural applications

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Quick Facts
Patent No.
US 8,470,923
App. No.
12/764,636
Granted
Jun 25, 2013
Kind
B2
Abstract

Composite material that contain epoxy resin which is toughened and strengthened with thermoplastic materials and a blend insoluble particles. The uncured matrix resins include an epoxy resin component, a soluble thermoplastic component, a curing agent and an insoluble particulate component composed of elastic particles and rigid particles. The uncured resin matrix is combined with a fibrous reinforcement and cured/molded to form composite materials that may be used for structural applications, such as primary structures in aircraft.

Claims (26)

1. An uncured composite material for use in structural applications comprising:

a fibrous reinforcement;

an uncured resin matrix comprising:

an epoxy resin component;

a soluble thermoplastic component;

an insoluble particulate component comprising rigid particles and elastic particles wherein the weight ratio of elastic particles to rigid particles ranges from 1:1.3 to 1:2.5; and

a curing agent.

2. An uncured composite material for use in structural applications according to claim 1 wherein said epoxy resin component comprises a trifunctional epoxy resin and a tetrafunctional epoxy resin.

3. An uncured composite material for use in structural applications according to claim 1 wherein said trifunctional epoxy resin is a trifunctional meta-glycidyl amine.

4. An uncured composite material for use in structural applications according to claim 1 wherein the said soluble thermoplastic component comprises polyethersulfone.

5. An uncured composite material for use in structural applications according to claim 1 wherein said elastic particles are polyurethane particles.

6. An uncured composite material for use in structural applications according to claim 1 wherein said rigid particles are selected from the group consisting of polyamide particles and polyamideimide particles.

7. An uncured composite material for use in structural applications according to claim 1 wherein said elastic particles comprise polyurethane particles and said rigid particles comprise polyamideimide particles and polyamide particles.

8. A composite material for use in structural applications according to claim 1 wherein said uncured resin matrix has been cured.

9. A composite material according to claim 8 wherein said composite material forms at least part of a primary aircraft structure.

10. An uncured composite material for use in structural applications according to claim 7 wherein the weight ratio of polyamideimide particles to polyamide particles ranges from 2:1 to 4:1.

11. An uncured composite material for use in structural applications according to claim 7 wherein the weight ratio of polyurethane particles to polyamide particles ranges from 3.0:1 to 1.5:1.

12. An uncured composite material for use in structural applications according to claim 1 wherein uncured resin matrix comprises conducting particles.

13. An uncured composite material for use in structural applications according to claim 12 wherein said conducting particles comprises carbon particles.

14. An uncured composite material for use in structural applications according to claim 2 wherein said trifunctional epoxy resin is present in an amount of from 27 to 38 weight percent of the total weight of the uncured resin matrix and said tetrafunctional epoxy resin is present in an amount of from 10 to 20 weight percent of the total weight of the uncured resin matrix.

15. An uncured composite material for use in structural applications according to claim 14 wherein said soluble thermoplastic component is present in an amount of from 10 to 20 weight percent of the total weight of the uncured resin matrix.

16. An uncured composite material for use in structural applications according to claim 15 wherein said soluble thermoplastic component comprises polyethersulfone.

17. An uncured composite material fbr use in structural applications according to claim 16 wherein said rigid particles comprise polyamideimide particles and polyamide particles wherein said polyamideimide particles are present in an amount of from 5 to 15 weight percent of the total weight of the uncured resin matrix and wherein said polyamide particles are present in an amount of from 1 to 5 weight of the total weight of the uncured resin matrix.

18. An uncured composite material for use in structural applications according to claim 17 wherein said elastic particles comprise polyurethane particles that are present in an amount of from 5 to 9 weight percent of the total weight of the uncured resin matrix.

19. An uncured composite material for use in structural applications according to claim 1 wherein said curing agent comprises 3,3′-diaminodiphenyl sulfone.

20. An uncured composite material for use in structural applications according to claim 18 wherein said curing agent comprises 3,3′-diaminodiphenyl sulfone.

Assignments (6)
RELEASE OF SECURITY INTEREST Recorded Oct 2, 2014
From: CITIZENS BANK, NATIONAL ASSOCIATION
To: HEXCEL CORPORATION; HEXCEL HOLDINGS LUXEMBOURG S.À.R.L.
Reel/Frame 033887/0199 →
RELEASE OF SECURITY INTEREST Recorded Sep 3, 2013
From: BANK OF AMERICA, N.A.
To: HEXCEL CORPORATION
Reel/Frame 031140/0729 →
SECURITY AGREEMENT Recorded Jul 1, 2013
From: HEXCEL CORPORATION; HEXCEL HOLDINGS LUXEMBOURG S.A.R.L.
To: RBS CITIZENS, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 030724/0287 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 24, 2010
From: BOYLE, MAUREEN; WU, YI-JUI; WANG, YEN-SEINE; FLORYANCIC, BRYCE
To: HEXCEL CORPORATION
Reel/Frame 024877/0903 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 24, 2010
From: BLAIR, DANA; MACKENZIE, PAUL
To: HEXCEL COMPOSITES LTD.
Reel/Frame 024878/0050 →
SECURITY AGREEMENT Recorded Aug 20, 2010
From: HEXCEL CORPORATION
To: BANK OF AMERICA, N.A.
Reel/Frame 024864/0016 →