IP Library Granted Patent US 9,379,153
Granted Patent B2
US 9,379,153 · App. 12/765,460 · Granted Jun 28, 2016

Method for forming image sensing device

Inventors: Jau-Jan Deng (Taipei, TW); Wei-Ping Chen (Taipei County, TW); Jui-Yi Chiu (Yilan County, TW)
Assignees: VisEra TECHNOLOGIES COMPANY LIMITED; OMNIVISION TECHNOLOGIES, INC.
H01L27/14618H01L27/14683H01L2924/0002
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Quick Facts
Patent No.
US 9,379,153
App. No.
12/765,460
Granted
Jun 28, 2016
Kind
B2
Abstract

A method for forming an image sensing device is disclosed, including providing a molding apparatus, disposing a lens in the molding apparatus, injecting an injection material into a chamber of the molding apparatus to form a shell which is connected to the lens, opening the chamber of the molding apparatus to remove the lens and the shell connected to the lens, and assembling the shell with an image sensing element.

Claims (41)

1. A method for forming an image sensing device, comprising:

providing a molding apparatus;

disposing a lens in the molding apparatus;

injecting an injection material into a chamber of the molding apparatus to form a shell which is connected to the lens; and

assembling the shell with an image sensing element,

wherein the lens is formed before injecting the injection material into the chamber; and

wherein the injection material is doped with a plurality of metal particles.

2. A method for forming an image sensing device, comprising

providing a molding apparatus;

disposing a lens in the molding apparatus;

injecting an injection material into a chamber of the molding apparatus to form a shell which is connected to the lens; and

assembling the shell with an image sensing element,

wherein the lens is formed before injecting the injection material into the chamber;

forming a metal layer on the lens before injecting the injection material into the chamber of the molding apparatus.

3. A method for forming an image sensing device, comprising:

providing a molding apparatus;

disposing a lens in the molding apparatus;

injecting an injection material into a chamber of the molding apparatus to form a shell which is connected to the lens;

assembling the shell with an image sensing element,

wherein the lens is formed before injecting the injection material into the chamber; and

forming a recess in the shell;

wherein the image sensing element is formed by the steps of:

providing a substrate;

forming a photoelectric element array on the substrate;

forming a micro lens array on the photoelectric element array;

forming a covering substrate over the substrate and the photoelectric element array;

forming a spacer for supporting the covering substrate; and

forming a plurality of solder balls under the substrate.

4. The method for forming an image sensing device as claimed in claim 3 , wherein assembling the shell with the image sensing element comprises fitting the covering substrate of the image sensing element into the recess of the shell.

5. A method for forming an image sensing device, comprising:

providing a molding apparatus;

disposing a lens in the molding apparatus;

injecting an injection material into a chamber of the molding apparatus to form a shell which is connected to the lens;

assembling the shell with an image sensing element,

wherein the lens is formed before injecting the injection material into the chamber;

wherein providing the molding apparatus further comprising:

providing a bottom mold;

forming a top mold over the bottom mold;

forming a base between the top mold and the bottom mold, wherein the bottom mold comprises a first protruding portion and a second protruding portion on the first protruding portion.

6. The method for forming an image sensing device as claimed in claim 5 , further comprising disposing a height adjusting element on the second protruding portion before injecting the injection material into the chamber of the molding apparatus.

7. The method for forming an image sensing device as claimed in claim 5 , further comprising adjusting height of the first protruding portion of the molding apparatus before injecting the injection material into the chamber of the molding apparatus.

Assignments (3)
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 026563 FRAME 0895. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNEES ARE OMNIVISION TECHNOLOGIES, INC. AND VISERA TECHNOLOGIES COMPANY LIMITED. Recorded Aug 11, 2011
From: VISERA TECHNOLOGIES COMPANY LIMITED
To: OMNIVISION TECHNOLOGIES, INC.; VISERA TECHNOLOGIES COMPANY LIMITED
Reel/Frame 026736/0545 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 8, 2011
From: VISERA TECHNOLOGIES COMPANY LIMITED
To: OMNIVISION TECHNOLOGIES, INC.
Reel/Frame 026563/0895 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 22, 2010
From: DENG, JAU-JAN; CHEN, WEI-PING; CHIU, JUI-YI
To: VISERA TECHNOLOGIES COMPANY LIMITED
Reel/Frame 024274/0467 →
Continuity (1)
Related Publication 20110260345A1 · Oct 27, 2011