METHODS AND DEVICES FOR AN ELECTRICALLY NON-RESISTIVE LAYER FORMED FROM AN ELECTRICALLY INSULATING MATERIAL
A method is described that provides a current carrying substrate and individually controlling film characteristics for a material being simultaneously formed on both sides of the substrate so as to provide a first layer of the material on one side substantially thicker than a second layer on another side of the substrate. The thinned layer is formed from an electrically insulating material but is configured such that the layer provides no significant electrical resistance to current passing through the layer.
1 . A deposition method.
2 . The method of claim 1 comprising:
providing a substrate suitable for carrying electrical current;
individually controlling film characteristics for a material being simultaneously formed on both sides of the substrate so as to provide a first layer of the material on one side substantially thicker than a second layer on another side of the substrate, wherein material is electrically insulating but the second layer is configured to provide no substantial electrical resistance to current passing from the substrate through the second layer or vice versa.
3 . The method of claim 1 comprising:
shielding a cathode on at least one side of the substrate during deposition to create the second layer with thinner material thickness.
4 . The method of claim 3 comprising:
wherein the second layer has an average maximum thickness of about 50 nm or less.
5 . The method of claim 3 comprising:
wherein the second layer has an average minimum thickness sufficient so that the second layer is electrically conductive.
6 . The method of claim 1 wherein the material comprises of alumina, but the second layer is electrically conductive.
7 . The method of claim 1 wherein the second layer comprises of a plurality of pores, wherein the second layer has an overall maximum thickness of 50 nm to 100 nm and having an overall minimum thickness of at least 5 nm.
8 . The method of claim 1 wherein the substrate comprises of aluminum.
9 . The method of claim 1 wherein the material is electrically insulating, except when used in a configuration of the second layer, wherein the second layer is electrically conductive despite being comprised of the material that is electrically insulating.
10 . The method of claim 1 comprising forming an electrically insulating layer on one side of the substrate while an opposite side of the substrate remains electrically conductive without using masking on the opposite side.
11 . The method of claim 1 comprising immersing a substrate in a bath to form an electrically insulating layer on one side of the substrate while an opposite side of the substrate remains electrically conductive without using masking on the opposite side.
12 . The method of claim 1 comprising immersing a substrate in a bath to form an electrically insulating layer on one side of the substrate while simultaneously forming an electrically conductive layer on an opposite side of the substrate without masking the opposite side.
13 . The method of claim 1 further comprising sputtering a layer of an electronically conductive metal over the second layer.
14 . The method of claim 14 wherein a thickness of the layer of electronically conductive metal is less than 25 nm.
15 . The method of claim 14 wherein a thickness of the layer of electronically conductive metal is less than conventionally used.
16 . A solar cell comprising:
an aluminum substrate having an anodized electrically insulating backside layer and an anodized electrically conductive front side layer;
an electrically conductive layer over the anodized electrically conductive front side layer;
a thin-film photovoltaic absorber layer over the electrically conductive layer; and
a junction partner layer over the photovoltaic absorber layer.
17 . The solar cell of claim 17 wherein the anodized electrically conductive front side layer has a plurality of pores.
18 . The solar cell of claim 18 wherein the pores have a diameter of 5 nm to 100 nm.
19 . The solar cell of claim 18 wherein bottoms walls of the pores are at least 5 nm thick.
20 . A method comprising:
providing an electrically conductive elongate flexible substrate;
individually controlling film characteristics for a material being formed on both sides of the substrate so as to provide a first layer of the material on one side substantially thicker than a second layer on another side of the substrate, the second layer configured to provide low electrical resistance while the first layer is configured to provide high electrical resistance,
wherein the first layer and the second layer are formed simultaneously and comprise of the same material;
applying stress to the second layer to introduce additional defects into the second layer; and
filling these defects with electrically conductive material.