INTEGRATED GUARDED SCHOTTKY DIODE COMPATIBLE WITH TRENCH-GATE DMOS, STRUCTURE AND METHOD
A plurality of transistor cells, each of which can include a transistor P-body region and a Schottky diode, wherein the transistor P-body region can be formed below the Schottky diode to provide a semiconductor device having desirable electrical characteristics.
1 . A method for forming a semiconductor device, comprising:
etching a semiconductor substrate to form a trench therein, the trench comprising a first sidewall, a second sidewall, and a bottom;
implanting a dopant having a first type conductivity into the semiconductor substrate at the bottom of the trench and into the first sidewall and the second sidewall of the trench to form a body contact region;
etching through a thickness of the body contact region at the bottom of the trench to remove a portion of the implanted body contact region such that a first portion and a second portion of the implanted body contact region remain in the first and second sidewalls respectively, wherein the first portion and the second portion of the implanted body contact region are disposed between a Schottky diode region and a transistor gate location; and
implanting the semiconductor substrate at the bottom of the trench with a dopant having a second type conductivity opposite to the first type conductivity.
2 . The method of claim 1 , further comprising:
adjusting a barrier height of the Schottky diode by implanting a dopant having the first type conductivity into the semiconductor substrate at the bottom of the trench.
3 . The method of claim 2 wherein, after forming the body contact region and adjusting a barrier height of the Schottky diode, a net conductivity of the semiconductor substrate at the bottom of the trench is the first type conductivity.
4 . The method of claim 2 wherein, after forming the body contact region and adjusting a barrier height of the Schottky diode, a net conductivity of the semiconductor substrate at the bottom of the trench is the second type conductivity.
5 . The method of claim 1 , further comprising:
forming at least one conductor within the trench,
wherein the etching through the thickness of the body contact region, the implanting of the dopant having the first type conductivity into the substrate at the bottom of the trench, and the formation of the at least one conductor within the trench results in the formation of the Schottky diode at a location above a body junction.
6 . The method of claim 5 , wherein the semiconductor substrate is doped to a net first conductivity type and the method further comprises:
during the implanting of the dopant having the second type conductivity into the substrate at the bottom of the trench, doping the bottom of the trench with a dopant having a second conductivity type opposite of the first conductivity type to a concentration sufficient to change a net dopant concentration from the first conductivity type to the second conductivity type.
7 . The method of claim 6 , further comprising:
implanting the substrate at the bottom of the trench with a dopant having the first conductivity type to a concentration which is sufficient to change a net doping concentration of the substrate at the bottom of the trench from the second conductivity type to the first conductivity type.
8 . The method of claim 6 , further comprising:
implanting the substrate at the bottom of the trench with a dopant having the first conductivity type to a concentration which is insufficient to change a net doping concentration of the substrate at the bottom of the trench from the second conductivity type to the first conductivity type.
9 . A semiconductor device, comprising:
a semiconductor substrate;
a plurality of transistors formed within the semiconductor substrate, wherein each transistor comprises:
a trench having a first sidewall, a second sidewall, and a bottom;
a body comprising a first body contact region and a second body contact region which abut the first sidewall and the second sidewall respectively;
a Schottky diode at an interface of the bottom of the trench and a conductor within the trench,
wherein a lower extent of the body is below the Schottky diode formed at the interface between the bottom of the trench and the conductor within the trench.
10 . The semiconductor device of claim 9 , wherein at least a portion of the body is shallower than the trench bottom.
11 . The semiconductor device of claim 9 , wherein the body extends between about 0.01 μm and about 0.4 μm below the Schottky diode.
12 . A semiconductor device, comprising:
a semiconductor substrate having a trench therein, the trench comprising a first sidewall, a second sidewall, and a bottom;
a body comprising a body contact region which abuts the first sidewall and the second sidewall, the body contact region comprising a first concentration of a dopant having a first conductivity type;
at least one conductive layer which fills the trench;
a compensation region within the substrate at the bottom of the trench, wherein the compensation region has a second concentration of the dopant having the first conductivity type and the second concentration is less than the first concentration; and
the compensation region within the substrate at the bottom of the trench further comprises a concentration of a dopant having a second conductivity type opposite of the first conductivity type.
13 . The semiconductor device of claim 12 , further comprising:
the compensation region within the substrate at the bottom of the trench has a net concentration of dopants having the first conductivity type.
14 . The semiconductor device of claim 12 , further comprising:
the compensation region within the substrate at the bottom of the trench has a net concentration of dopants having the second conductivity type.
15 . An electronic system comprising a metal oxide semiconductor field effect transistor (MOSFET), wherein the MOSFET comprises:
a semiconductor substrate;
a plurality of transistors formed within the semiconductor substrate, wherein each transistor comprises:
a trench having a first sidewall, a second sidewall, and a bottom;
a body comprising a first body contact region and a second body contact region which abut the first sidewall and the second sidewall respectively;
a Schottky diode at an interface of the bottom of the trench and a conductor within the trench,
wherein a lower extent of the body is below the Schottky diode formed at the interface between the bottom of the trench and the conductor within the trench.
16 . The electronic system of claim 15 , wherein at least a portion of the body of the MOSFET is shallower than the trench bottom.
17 . The electronic system of claim 15 , further comprising:
a voltage regulator; and
the voltage regulator includes the MOSFET.