IP Library Granted Patent US 7,985,105
Granted Patent B2
US 7,985,105 · App. 12/770,558 · Granted Jul 26, 2011

Multilayer wave springs with different properties

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,985,105
App. No.
12/770,558
Granted
Jul 26, 2011
Kind
B2
Abstract

A circular or plate wave spring that maintains high conductivity under high operating temperatures is provided herein. This is possible due to, at least in part, the conductor being made from a bi-metallic or multi-metallic material which can include a high tensile strength material, such as steel, that maintains strength properties at elevated temperatures cladded with a layer of highly conductive metal, such as copper. The high tensile strength material helps maintain the contact force needed for good conductivity since highly conductive metals and alloys tend to lose their tensile properties at elevated temperatures. The connector is presented here as a wave spring providing inward or outward protrusions for a conductive pin and housing.

Claims (29)

1. A method for forming a conductive wave spring assembly comprising:

forming a generally planar body section comprising a first layer having a first conductive property and a first tensile strength property and a second layer having a second conductive property and a second tensile strength property,

forming a first set of two slits along a first direction and a first protrusion between the first set of two slits;

forming a second set of two slits along a second direction at an angle to the first direction and a second protrusion between the second set of two slits; and

wherein the second conductive property is higher than the first conductive property.

2. The method of claim 1 , further comprising forming a third set of two slits and deforming a surface layer between the third set of two slits to form a third protrusion.

3. The method of claim 1 , wherein the second conductive property extends furthest outwardly on the first protrusion and the second protrusion.

4. The method of claim 1 , further comprising forming a third set of two slits along the second direction and third protrusion between the third set of two slits.

5. The method of claim 1 , wherein the second layer is made from at least one of copper, copper alloy, aluminum, aluminum alloy, gold, gold alloy, silver, silver alloy, brass, and brass alloy.

6. The method of claim 1 , wherein the first layer is made from at least one of stainless steel, carbon steel, INCONEL® alloys, and HASTELLOY® alloys.

7. The method of claim 4 , wherein the first set of two slits is located at a first end of the second set of two slits and the third set of two slits is located at a second end of the second set of two slits.

8. The method of claim 1 , further comprising a third clad layer formed on the body section.

9. The method of claim 1 , wherein the two slits of the first set of two slits are generally parallel to one another.

10. The method of claim 1 , wherein the angle is 90 degrees.

11. A wave spring assembly comprising:

a generally planar body section comprising a first layer having a first conductive property and a first tensile strength property and a second layer having a second conductive property and a second tensile strength property,

a first set of two slits and a first protrusion located between the first set of two slits formed upon the generally planar body section;

a second set of two slits and a second protrusion located between the second set of two slits formed upon the generally planar body section;

wherein the first set of two slits is formed along a first direction and the second set of two slits is formed along a second direction, which is at an angle to the first direction; and

wherein the second conductive property is higher than the first conductive property.

12. The wave spring assembly of claim 11 , wherein the angle is 90 degrees.

13. The wave spring assembly of claim 11 , further comprising a third set of two slits and a third protrusion located between the third set of two slits formed upon the generally planar body section.

14. The wave spring assembly of claim 12 , wherein the second conductive property extends furthest outwardly on the first protrusion and the second protrusion.

15. The wave spring assembly of claim 11 , wherein the second layer is made from at least one of copper, copper alloy, aluminum, aluminum alloy, gold, gold alloy, silver, silver alloy, brass, and brass alloy.

16. The wave spring assembly of claim 11 , wherein the first layer is made from at least one of stainless steel, carbon steel, INCONEL® alloys, and HASTELLOY® alloys.

17. The wave spring assembly of claim 13 , wherein the first set of two slits is located at a first end of the second set of two slits and the third set of two slits is located at a second end of the second set of two slits.

18. The wave spring assembly of claim 11 , further comprising a third clad layer formed upon the body section.

19. The wave spring assembly of claim 11 , wherein the two slits of the first set of two slits are generally parallel to one another.

20. The wave spring assembly of claim 11 , wherein the angle is 90 degrees.

Assignments (6)
SECURITY INTEREST Recorded Feb 27, 2025
From: X-MICROWAVE, LLC; TANTALUM PELLET COMPANY, LLC; EVANS CAPACITOR COMPANY, LLC; PACIFIC AEROSPACE & ELECTRONICS, LLC; OHIO ASSOCIATED ENTERPRISES, LLC; FILCONN, LLC; HERMETIC SOLUTIONS GROUP INC.; RUBBERCRAFT CORPORATION OF CALIFORNIA, LTD.; SWIFT TEXTILE METALIZING LLC; RMB PRODUCTS; BAL SEAL ENGINEERING, LLC; KAMATICS CORPORATION; BEI PRECISION SYSTEMS & SPACE COMPANY, INC.; PAKTRON LLC; OHMEGA TECHNOLOGIES, LLC; TICER TECHNOLOGIES, LLC; CUSTOM INTERCONNECTS, LLC; SANDERS INDUSTRIES HOLDINGS, INC.; AKROFIRE, LLC; KAMAN AEROSPACE CORPORATION; KAMAN CORPORATION
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 070344/0430 →
RELEASE OF INTELLECTUAL PROPERTY SECURITY AGREEMENTS (PATENTS) AT REEL 067175/FRAME 0740 Recorded Feb 27, 2025
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: KAMAN CORPORATION; KAMAN AEROSPACE CORPORATION; BAL SEAL ENGINEERING, LLC; AIRCRAFT WHEEL AND BRAKE, LLC; KAMATICS CORPORATION
Reel/Frame 070347/0014 →
RELEASE OF SECURITY INTEREST Recorded Apr 23, 2024
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: KAMATICS CORPORATION; BAL SEAL ENGINEERING, LLC; AIRCRAFT WHEEL AND BRAKE, LLC
Reel/Frame 067200/0800 →
IP SECURITY AGREEMENT Recorded Apr 22, 2024
From: KAMAN CORPORATION; KAMAN AEROSPACE CORPORATION; BAL SEAL ENGINEERING, LLC; AIRCRAFT WHEEL AND BRAKE, LLC; KAMATICS CORPORATION
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 067175/0740 →
AMENDED AND RESTATED PATENT COLLATERAL SECURITY AND PLEDGE AGREEMENT Recorded Sep 18, 2020
From: KAMATICS CORPORATION; BAL SEAL ENGINEERING, LLC
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 054304/0388 →
CHANGE OF NAME Recorded Apr 15, 2020
From: BAL SEAL ENGINEERING, INC.
To: BAL SEAL ENGINEERING, LLC
Reel/Frame 052410/0399 →