Granted Patent B2

US 8,414,309 · App. 12/772,462 · Granted Apr 9, 2013

Abstract

Claims (51)

1. An optical communications system comprising:

an optical transceiver module having at least first, second, third, and fourth outer sides, a top portion, and a bottom portion;

a non-hermetically-sealing protective socket comprising a bottom and first, second, third, and fourth side walls, each of the side walls having a first side that is in contact with the bottom and having a second side that is parallel to the first side, the first side wall extending between the second and fourth side walls, the second side wall extending between the first and third side walls, the third side wall extending between the second and fourth side walls, the fourth side wall extending between the first and third side walls, the bottom having a bottom surface and a top surface, wherein a combination of the side walls and the bottom of the protective socket define a receptacle for holding the optical transceiver module, the receptacle having a length and a width that are slightly larger than a length and width, respectively, of the optical transceiver module to allow the optical transceiver module to be held within the receptacle, the receptacle having a height that is approximately equal to a height of the optical transceiver module, wherein the optical transceiver module is seated within the receptacle such that the bottom portion of the optical transceiver module is adjacent the top surface of the bottom of the protective socket and such that the first, second, third, and fourth outer sides of the optical transceiver module are surrounded by the first, second, third, and fourth side walls of the protective socket, and wherein the side walls and the bottom of the protective socket provide a physical barrier that impedes ingress of airborne particles into an interior portion of the optical transceiver module;

a first array of electrical contacts disposed on the bottom surface of the protective socket; and

a second array of electrical contacts disposed on the top surface of the bottom of the protective socket, wherein respective electrical contacts of the first array of electrical contacts are electrically coupled to respective electrical contacts of the second array of electricalcontacts, and wherein respective electrical contacts disposed on the bottom portion of the optical transceiver module are in contact with respective electrical contacts of the second array of electrical contacts.

2. The optical communications system of claim 1 , wherein the first and second arrays of electrical contacts and the bottom of the protective socket comprise a ball grid array.

3. The optical communications system of claim 1 , wherein the side walls and bottom of the protective socket are made of molded plastic.

4. The optical communications system of claim 1 , further comprising:

a system circuit board on which the protective socket is mounted, the system circuit board having electrical contacts thereon that are in contact with respective electrical contacts of the first array of electrical contacts of the protective socket.

5. The optical communications system of claim 4 , further comprising:

an external heat sink device secured to the system circuit board and surrounding the protective socket, wherein one or more portions of the external heat sink device are in contact with one or more heat sink blocks of the optical transceiver module.

6. The optical communications system of claim 1 , further comprising:

a clip having a first side portion, a second side portion and a top portion, the first and second side portions being mechanically coupled to the second and fourth side walls, respectively, of the protective socket, wherein the clip provides an additional physical barrier that impedes ingress of airborne particles into the interior portion of the optical transceiver module.

7. The optical communications system of claim 6 , wherein an optical connector is connected to the top portion of the optical transceiver module and wherein a lower surface of the top portion of the clip is in contact with the optical connector and wherein the clip exerts a force on the optical connector that maintains the optical connector in position on the top portion of the optical transceiver module, the optical connector being connected to a first end of an optical fiber cable, the first end of the optical fiber cable passing through an opening formed in the first side portion of the clip.

8. The optical communications system of claim 7 , wherein the clip is made of molded plastic.

9. The optical communications system of claim 7 , wherein the clip is made of sheet metal.

10. The optical communications system of claim 7 , further comprising:

a system circuit board on which the protective socket is mounted, the system circuit board having electrical contacts thereon that are in contact with respective electrical contacts of the first array of electrical contacts of the protective socket.

11. The optical communications system of claim 10 , further comprising:

an external heat sink device secured to the system circuit board and surrounding the protective socket, wherein one or more portions of the external heat sink device are in contact with one or more heat sink blocks of the optical transceiver module.

12. An optical communications system comprising:

an optical transceiver module, the optical transceiver module having at least first, second, third, and fourth outer sides, a top portion, and a bottom portion, the optical transceiver module having a height, H 1 , a width, W 1 , and a length, L 2 ;

a non-hermetically-sealing protective socket comprising:

a bottom and first, second, third, and fourth side walls, each of the side walls having a first side that is in contact with the bottom and having a second side that is parallel to the first side, the first side wall extending between the second and fourth side walls, the second side wall extending between the first and third side walls, the third side wall extending between the second and fourth side walls, the fourth side wall extending between the first and third side walls, the bottom having a bottom surface and a top surface, wherein a combination of the side walls and the bottom of the protective socket define a receptacle in which the optical transceiver module is held, the receptacle having a height, H 2 , that is approximately equal to the height, H 1 , of the optical transceiver module, the receptacle having a width, W 2 , and a length, L 2 , that are slightly greater than the width, W 1 and length, L 1 , respectively, of the optical transceiver module, wherein the optical transceiver module is seated within the receptacle of the protective socket such that the side walls of the protective socket and the bottom of the protective socket surround the outer sides and bottom portion of the optical transceiver module and provide a physical barrier that impedes ingress of airborne particles into an interior portion of the optical transceiver module;

a first array of electrical contacts disposed on the bottom surface of the bottom of the protective socket; and

a second array of electrical contacts disposed on the top surface of the bottom of the protective socket, wherein respective electrical contacts of the first array of electrical contacts are electrically coupled to respective electrical contacts of the second array of electrical contacts, and wherein respective electrical contacts disposed on the bottom portion of the optical transceiver module are in contact with respective electrical contacts of the second array of electrical contacts.

13. The optical communications system of claim 11 , wherein the first and second arrays of electrical contacts and the bottom of the protective socket comprise a ball grid array.

14. The optical communications system of claim 11 , wherein the side walls and bottom of the protective socket are made of molded plastic.

15. The optical communications system of claim 11 , further comprising:

a system circuit board on which the protective socket is mounted, the system circuit board having electrical contacts thereon that are in contact with respective electrical contacts of the first array of electrical contacts of the protective socket.

16. The optical communications system of claim 15 , further comprising:

an external heat sink device secured to the system circuit board and surrounding the protective socket, wherein one or more portions of the external heat sink device are in contact with one or more heat sink blocks of the optical transceiver module.

17. The optical communications system of claim 11 , further comprising:

a clip having a first side portion, a second side portion and a top portion, the first and second side portions being mechanically coupled to the second and fourth side walls, respectively, of the protective socket, wherein the clip provides an additional physical barrier that impedes ingress of airborne particles into the interior portion of the optical transceiver module.

18. The optical communications system of claim 17 , wherein an optical connector is connected to a top portion of the optical transceiver module and wherein a lower surface of the top portion of the clip is in contact with the optical connector and wherein the clip exerts a force on the optical connector that maintains the optical connector in position on the top portion of the optical transceiver module, the optical connector being connected to a first end of an optical fiber cable, the first end of the optical fiber cable passing through an opening formed in the first side portion of the clip.

19. The optical communications system of claim 18 , wherein the clip is made of molded plastic.

20. The optical communications system of claim 18 , wherein the clip is made of sheet metal.

21. The optical communications system of claim 18 , further comprising:

an external heat sink device secured to the system circuit board and surrounding the protective socket, wherein one or more portions of the external heat sink device are in contact with one or more heat sink blocks of the optical transceiver module.

22. A method for impeding ingress of airborne particles into an optical transceiver module, the method comprising:

providing an optical transceiver module having a height, a width and a length, the optical transceiver module having at least first, second, third, and fourth outer sides, a bottom portion, and a top portion;

providing a non-hermetically-sealing protective socket having first, second, third, and fourth side walls and a bottom that together form a receptacle, the receptacle having a height, a width and a length, the protective socket having a first array of electrical contacts disposed on a bottom surface of the bottom of the protective socket and a second array of electrical contacts disposed on a top surface of the bottom of the protective socket; and

seating the optical transceiver module within the receptacle such that the bottom portion of the optical transceiver module is adjacent the top surface of the bottom of the protective socket and such that the first, second, third, and fourth outer sides of the optical transceiver module are surrounded by the first, second, third, and fourth aide walls of the protective socket, wherein respective electrical contacts of the first array of electrical contacts are electrically coupled to respective electrical contacts of the second array of electrical contacts, and wherein respective electrical contacts disposed on the bottom portion of the optical transceiver module are in contact with respective electrical contacts of the second array of electrical contacts, and wherein the length and width of the receptacle are slightly greater than the length and width, respectively, of the optical transceiver module, and wherein the height of the receptacle is approximately equal to the height of the optical transceiver module, and wherein the side walls and the bottom of the protective socket provide a physical barrier that impedes ingress of airborne particles into an interior portion of the optical transceiver module.

23. The method of claim 22 , wherein the first and second arrays of electrical contacts and the bottom of the protective socket comprise a ball grid array.

24. The method of claim 22 , further comprising:

providing a system circuit board on which the protective socket is mounted, the system circuit board having electrical contacts thereon that are in contact with respective electrical contacts of the first array of electrical contacts of the protective socket.

25. The method of claim 24 , further comprising:

providing an external heat sink device secured to the system circuit board and surrounding the protective socket, wherein one or more portions of the external heat sink device are in contact with one or more heat sink blocks of the optical transceiver module.

26. The method of claim 22 , further comprising:

providing a clip having a first side portion, a second side portion and a top portion, the first and second side portions being mechanically coupled to the second and fourth side walls of the protective socket, wherein the clip provides an additional physical barrier that impedes the ingress of airborne particles into the interior portion of the optical transceiver module.

27. The method of claim 26 , wherein an optical connector is connected to a top portion of the optical transceiver module and wherein a lower surface of the top portion of the clip is in contact with the optical connector and wherein the clip exerts a force on the optical connector that maintains the optical connector in position on the top portion of the optical transceiver module, the optical connector being connected to a first end of an optical fiber cable, the first end of the optical fiber cable passing through an opening formed in the first side portion of the clip.

Assignments (9)