Solid state switching device with integral heatsink
View Patent ↗Solid state switching device having a heatsink, a solid state switching element in heat conductive relationship with the heatsink, and an enclosure having ventilation openings adjacent to the heatsink through which air can flow to remove heat from the heatsink. In some disclosed embodiments, the heatsink has fins and ducts aligned with ventilation openings in the enclosure for removing heat by radiation and convection. In others, the heatsink is a generally planar baseplate, with ventilation openings in a side wall of the enclosure next to the baseplate for removing heat from the device. Spacers project laterally from the devices and permit a plurality of the devices to mounted side-by-side with space between the devices through which air can flow.
1. A solid state switching device comprising a heatsink having a generally planar base, first and second groups of heat conductive fins extending in opposite directions from opposite sides of the base with open ended ducts between the fins on both sides of the base, a solid state switching element in heat conductive relationship with the base beside the second group of fins, and an enclosure having ventilation openings in axial alignment with the open ended ducts through which air can flow to remove heat from the heatsink by radiation and convection.
2. The switching device of claim 1 including a third group of fins and ducts on the side of the base with the second group.
3. The switching device of claim 1 including control circuitry on the side of the base with the second group of fins.
4. A solid state switching device comprising a heatsink having a generally planar base and two groups of heat conductive fins with open ended ducts between the fins on one side of the base, a switching element positioned between the two groups of fins on the one side of the base, and an enclosure having ventilation openings in registration with the ducts through which air can flow to remove heat from the heatsink by radiation and convection and a ventilation grill on the side of the base opposite the switching element through which air can flow to carry additional heat away from the heatsink.
5. A solid state switching device, comprising a heatsink having a plurality of heat conductive fins with open ended ducts between the fins, a solid state switching element in heat conductive relationship with the heatsink, an enclosure having ventilation openings in registration with the ducts and first and second generally planar side walls which permit a plurality of the solid state switching devices to be mounted side-by-side with the first side wall of one device facing the second side wall of another, additional ventilation openings in one of the side walls, and spacers projecting laterally from one of the side walls to maintain space for air flow between the side walls of adjacent ones of the devices.
6. A solid state switching device, comprising an enclosure having a pair of laterally spaced side walls of substantially greater dimension than the spacing between them, upper and lower walls with vertically aligned vent openings, mounting means toward the rear of the enclosure for mounting the enclosure in an upright position with the side walls extending vertically, a heatsink within the enclosure having a generally planar base extending in a direction parallel to the side walls of the enclosure, with a generally planar mounting surface and a plurality of air ducts aligned axially with the vent openings in the upper and lower walls on opposite sides of the base, a solid state switching element mounted on a circuit board having a generally planar surface opposite the switching element in thermally conductive contact with the mounting surface of the heatsink, terminals accessible outside the enclosure for connection to an electrical circuit controlled by the switching element, and leads interconnecting the switching element and the terminals.
7. The switching device of claim 6 wherein the terminals are lugs that are mounted on and supported by the leads.
8. The switching device of claim 6 wherein the terminals are terminal blocks.
9. The switching device of claim 6 wherein the leads are mounted directly to the circuit board and are an integral part of electrical circuitry mounted on the board.
10. A solid state switching device, comprising an enclosure having a pair of laterally spaced side walls of substantially greater dimension than the spacing between them, upper and lower walls with vertically aligned vent openings, mounting means for mounting the enclosure in an upright position with the side walls extending vertically, a heatsink within the enclosure having a generally planar mounting surface and a plurality of air ducts aligned axially with the vent openings in the upper and lower walls, a circuit board having a generally planar surface on one side thereof in thermally conductive contact with the mounting surface of the heatsink, a solid state switching element on a second side of the circuit board, terminals accessible outside the enclosure for connection to an electrical circuit controlled by the switching element, and leads interconnecting the switching element and the terminals, with the switching element mounted directly on the leads and the leads in thermally conductive contact with the circuit board.
11. A solid state switching device comprising an enclosure having a pair of laterally spaced side walls of substantially greater dimension than the spacing between the walls, upper and lower walls with aligned vent openings, a compartment offset outwardly from one of the side walls, with aligned vent openings in upper and lower walls of the compartment, mounting means toward the rear of the enclosure for mounting the enclosure in an upright position; a heatsink having a generally planar base which is positioned between and generally parallel to the side walls of the enclosure, a first group of air ducts on a first side of the base aligned with the vent openings in the upper and lower walls of the enclosure, and a second group of air ducts on a second side of the base in alignment with the vent openings in the upper and lower walls of the compartment; a solid state switching element mounted on a circuit board in thermally conductive contact with the first side of the base of the heatsink; terminals accessible outside the enclosure for connection to an electrical circuit controlled by the switching element; and electrically conductive leads interconnecting the switching element and the terminals.
12. The switching device of claim 11 wherein the heatsink has a third group of air ducts on the first side of the base on the opposite side of the circuit board from the first group of ducts and in axial alignment with additional vent openings in the upper and lower walls of the enclosure.
13. The switching device of claim 11 including spacers projecting laterally from one side of the enclosure for maintaining space for air flow between the enclosures of a plurality of the switching devices mounted side-by-side.
14. A solid state switching device, comprising an enclosure having a pair of laterally spaced side walls of substantially greater dimension than the spacing between upper and lower walls with vertically aligned vent openings, mounting means toward the rear of the enclosure for mounting the enclosure in an upright position with the side walls extending vertically, the mounting means including means for mounting the device in an electrical panel and means for mounting the device on a DIN rail, a heatsink within the enclosure having a generally planar mounting surface and a plurality of air ducts aligned axially with the vent openings in the upper and lower walls, a solid state switching element mounted on a circuit board having a generally planar surface opposite the switching element in thermally conductive contact with the mounting surface of the heatsink, terminals accessible outside the enclosure for connection to an electrical circuit controlled by the switching element, and leads interconnecting the switching element and the terminals.
15. A solid state switching device, comprising a heatsink having a generally planar baseplate, a circuit board having a generally planar rear surface in direct thermal contact with the baseplate throughout the entire lateral extent of the rear surface, a solid state switching element mounted on the front side of the circuit board facing away from the baseplate in heat conductive relationship with the heatsink through the circuit board, and an enclosure having first and second generally planar side walls which permit a plurality of the solid state switching devices to be mounted side-by-side with the first side wall of one device facing the second side wall of another, ventilation openings in one of the side walls adjacent to the heatsink through which air can flow to remove heat from the heatsink, and spacers that project laterally from one of the side walls to maintain space for air from the ventilation openings to flow between the side walls of adjacent ones of the devices.