IP Library Granted Patent US 8,188,381
Granted Patent B2
US 8,188,381 · App. 12/774,784 · Granted May 29, 2012

Mid-board module retention and EMI cage

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Quick Facts
Patent No.
US 8,188,381
App. No.
12/774,784
Granted
May 29, 2012
Kind
B2
Abstract

A module retention and electromagnetic interference (EMI) cage has a substantially flat, rectangular metal frame with retaining clip portions and EMI-shielding contact fingers. The frame has surface-mount legs to facilitate surface mounting the cage to the circuit board. An array connector is mounted on the circuit board within a central region of the cage. An electronic module can be inserted or plugged into the cage in conjunction with connecting the module to the array connector. As the module is inserted into the cage, the module resiliently deflects the EMI-shielding contact fingers. At approximately the same time as the connector of the electronic module mates with the array connector, the retaining clip portion mates with a portion of the housing to retain the module in this position.

Claims (33)

1. A module retention and electromagnetic interference (EMI) cage system, comprising:

an array connector mounted on a surface of a circuit board;

an EMI cage mounted on the circuit board, the EMI cage comprising a substantially flat, rectangular metal frame having a first side, a second side, a third side opposite the first side, and a fourth side opposite the second side, each of the first, second, third and fourth sides substantially perpendicular to a plane defining the substantially flat shape of the frame, the array connector disposed within a central region bounded by a perimeter defined by the first, second, third and fourth sides, at least one of the sides having a retaining clip portion, at least two of the first, second, third and fourth sides each having one or more mounting legs extending away from the perimeter parallel to the plane and mounted on the surface of the circuit board, and at least two of the first, second, third and fourth sides each having an EMI skirt comprising three or more closely spaced resiliently deflectable EMI-shielding contact fingers; and

an opto-electronic transceiver module pluggably coupled to the array connector by a mating connector on the opto-electronic transceiver module, wherein the EMI skirt of the EMI cage forms an EMI seal around a periphery of the opto-electronic transceiver module, and the retaining clip portion of the EMI cage engages a portion of the opto-electronic transceiver module.

2. The module retention and EMI cage claimed in claim 1 , wherein the frame is unitarily formed from a single piece of sheet metal.

3. The module retention and EMI cage claimed in claim 1 , wherein each of the first and third sides includes a retaining clip portion.

4. The module retention and EMI cage claimed in claim 3 , wherein the retaining clip portion comprises a resiliently deflectable tab having an opening, the opening engageable with a protrusion on a surface of the electronic module.

5. The module retention and EMI cage claimed in claim 1 , wherein each of the first, second, third and fourth sides includes a plurality of the resiliently deflectable EMI-shielding contact fingers.

6. The module retention and EMI cage claimed in claim 1 , wherein each of the EMI-shielding contact fingers has a distal end outwardly angled away from the central region.

7. The module retention and EMI cage claimed in claim 1 , wherein each of the first, second, third and fourth sides has a top and a bottom defining a height of the frame, wherein the height of the frame is less than about one-fourth of a distance between two opposite ones of the first, second, third and fourth sides, whereby the substantially flat shape of the frame is provided by a ratio between the height of the frame and the distance between two opposite sides of the frame.

8. The module retention and EMI cage claimed in claim 1 , wherein:

each of the first and third sides includes a retaining clip portion;

each of the first and third sides includes a plurality of the resiliently deflectable EMI-shielding contact fingers with the retaining clip portion therebetween; and

each of the second and fourth sides includes a plurality of the resiliently deflectable EMI-shielding contact fingers and does not include a retaining clip portion.

9. A method for using a module retention and electromagnetic interference (EMI) cage, the cage surface-mounted around an array connector mounted on a circuit board, the cage comprising a substantially planar, rectangular metal frame having a first side, a second side, a third side opposite the first side, and a fourth side opposite the second side, each of the first, second, third and fourth sides substantially perpendicular to a plane defining the substantially planar shape of the frame, at least two of the sides each having an EMI skirt comprising three or more closely spaced EMI-shielding contact fingers, the method comprising:

plugging an opto-electronic transceiver module into a central region of the frame by inserting the electronic module until a portion of the opto-electronic transceiver module mates with a retaining clip portion of one of the sides, the opto-electronic transceiver module mates with the array connector, and the EMI skirt forms an EMI seal around a periphery of the opto-electronic transceiver module.

10. The method claimed in claim 9 , wherein inserting the electronic module comprises a retaining clip portion in each of the first and third sides engaging the electronic module to retain the module in the cage.

11. The method claimed in claim 10 , wherein each retaining clip portion comprises a resiliently deflectable tab having an opening, and inserting the electronic module comprises the opening engaging a protrusion on a surface of the electronic module.

12. The method claimed in claim 9 , wherein inserting the electronic module comprises outwardly angled distal ends of a plurality of the EMI-shielding contact fingers wiping a plurality of sides of the electronic module.

13. A module retention and electromagnetic interference (EMI) cage system, comprising:

an array connector mounted on a surface of a circuit board;

an EMI cage mounted on the circuit board, the EMI cage comprising a substantially flat, rectangular metal frame having a first side, a second side, a third side opposite the first side, and a fourth side opposite the second side, each of the first, second, third and fourth sides substantially perpendicular to a plane defining the substantially flat shape of the frame, the array connector disposed within a central region bounded by a perimeter defined by the first, second, third and fourth sides, at least one of the sides having a means for retaining an electronic module, at least two of the first, second, third and fourth sides each having means for mounting the frame to the surface of the circuit board, and at least two of the first, second, third and fourth sides each having a means for providing an EMI seal; and

an opto-electronic transceiver module pluggably coupled to the array connector by a mating connector on the opto-electronic transceiver module, wherein the means for providing an EMI seal provides an EMI seal around a periphery of the opto-electronic transceiver module, and the means for retaining an electronic module engages a portion of the opto-electronic transceiver module.

14. The module retention and EMI cage claimed in claim 13 , wherein the frame is unitarily formed from a single piece of sheet metal.

15. The module retention and EMI cage claimed in claim 13 , wherein the means for retaining the electronic module comprises a retaining clip portion on each of the first and third sides.

16. The module retention and EMI cage claimed in claim 15 , wherein the retaining clip portion comprises a resiliently deflectable tab having an opening, the opening engageable with a protrusion on a surface of the electronic module.

17. The module retention and EMI cage claimed in claim 13 , wherein the means for providing an EMI seal comprises a plurality of resiliently deflectable EMI-shielding contact fingers on each of the first, second, third and fourth sides.

18. The module retention and EMI cage claimed in claim 17 , wherein each of the EMI-shielding contact fingers includes means for providing a wiping action.

19. The module retention and EMI cage claimed in claim 13 , wherein each of the first, second, third and fourth sides has a top and a bottom defining a height of the frame, wherein the height of the frame is less than about one-fourth of a distance between two opposite ones of the first, second, third and fourth sides, whereby the substantially flat shape of the frame is provided by a ratio between the height of the frame and the distance between two opposite sides of the frame.

20. The module retention and EMI cage claimed in claim 13 , wherein:

each of the first and third sides includes a retaining clip portion;

each of the first and third sides includes a plurality of resiliently deflectable EMI-shielding contact fingers with the retaining clip portion therebetween; and

each of the second and fourth sides includes a plurality of the resiliently deflectable EMI-shielding contact fingers and does not include a retaining clip portion.

Assignments (10)
MERGER Recorded Mar 3, 2023
From: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED; BROADCOM INTERNATIONAL PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 062952/0850 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 14, 2020
From: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
To: BROADCOM INTERNATIONAL PTE. LTD.
Reel/Frame 053771/0901 →
CORRECTIVE ASSIGNMENT TO CORRECT THE EFFECTIVE DATE OF MERGER TO 09/05/2018 PREVIOUSLY RECORDED AT REEL: 047230 FRAME: 0133. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Oct 29, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047630/0456 →
MERGER Recorded Oct 4, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047230/0133 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032851-0001) Recorded Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 037689/0001 →
PATENT SECURITY AGREEMENT Recorded May 8, 2014
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032851/0001 →
MERGER Recorded May 7, 2013
From: AVAGO TECHNOLOGIES FIBER IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 030369/0672 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 6, 2010
From: CHAN, SENG-KUM
To: AVAGO TECHNOLOGIES FIBER IP (SINGAPORE) PTE. LTD.
Reel/Frame 024344/0078 →