IP Library Granted Patent US 8,154,052
Granted Patent B2
US 8,154,052 · App. 12/775,201 · Granted Apr 10, 2012

Light emitting device grown on wavelength converting substrate

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Quick Facts
Patent No.
US 8,154,052
App. No.
12/775,201
Granted
Apr 10, 2012
Kind
B2
Abstract

In some embodiments of the invention, a device includes a substrate and a semiconductor structure. The substrate includes a wavelength converting element comprising a wavelength converting material disposed in a transparent material, a seed layer comprising a material on which III-nitride material will nucleate, and a bonding layer disposed between the wavelength converting element and the seed layer. The semiconductor structure includes a III-nitride light emitting layer disposed between an n-type region and a p-type region, and is grown on the seed layer.

Claims (41)

1. A device comprising:

a substrate comprising:

a wavelength converting element comprising a wavelength converting material disposed in a transparent material;

a seed layer comprising a material on which III-nitride material nucleates; and

a bonding layer disposed between the wavelength converting element and the seed layer; and

a semiconductor structure grown on the seed layer, the semiconductor structure comprising a III-nitride light emitting layer disposed between an n-type region and a p-type region.

2. The device of claim 1 wherein a luminescent property of the wavelength converting element is reduced less than 20% when the wavelength converting element is exposed to a temperature greater than 800° C. for at least two hours.

3. The device of claim 1 wherein the wavelength converting material is phosphor and the transparent material is one of glass, quartz, and SiO 2 .

4. The device of claim 1 wherein:

the wavelength converting material is disposed in a first portion of the transparent material; and

a second portion of the transparent material is without wavelength converting material.

5. The device of claim 1 wherein the wavelength converting element comprises a wavelength converting material disposed in a transparent material, bonded to a ceramic phosphor.

6. A device comprising:

a substrate comprising:

a wavelength converting element;

a seed layer comprising a material on which III-nitride material nucleates; and

a dichroic filter disposed between the wavelength converting element and the seed layer; and

a semiconductor structure grown on the seed layer, the semiconductor structure comprising a III-nitride light emitting layer disposed between an n-type region and a p-type region.

7. The device of claim 6 wherein the dichroic filter is configured to reflect light of a wavelength emitted by the wavelength converting element.

8. The device of claim 6 wherein the wavelength converting element comprises a ceramic phosphor.

9. The device of claim 6 wherein the wavelength converting element comprises a wavelength converting material disposed in a transparent material.

10. The device of claim 6 further comprising a bonding layer disposed between the dichroic filter and the seed layer.

11. A device comprising:

a substrate comprising:

a wavelength converting element;

a seed layer comprising a material on which III-nitride material nucleates; and

a bonding layer disposed between the wavelength converting element and the seed layer;

a semiconductor structure grown on the seed layer, the semiconductor structure comprising a III-nitride light emitting layer disposed between an n-type region and a p-type region; and

a scattering structure configured to scatter light emitted by at least one of the III-nitride light emitting layer and the wavelength converting element.

12. The device of claim 11 wherein the scattering structure comprises a III-nitride layer with a rough surface.

13. The device of claim 12 further comprising a transparent conductive layer disposed between the rough surface and a metal contact.

14. The device of claim 12 further comprising:

a transparent insulating layer disposed between the rough surface and a metal contact, wherein the transparent insulating layer has a planar top surface; and

at least one opening formed in the transparent insulating layer, wherein conductive material is disposed in the opening.

15. The device of claim 11 wherein the scattering structure comprises a periodic variation in index of refraction, wherein the variation is in a direction parallel to a major surface of the light emitting layer.

16. The device of claim 15 wherein the periodic variation in index of refraction is disposed within the n-type region.

17. The device of claim 15 wherein the periodic variation in index of refraction is disposed between the n-type region and the seed layer.

18. The device of claim 11 wherein the wavelength converting element comprises a phosphor capable of emitting red light.

19. The device of claim 18 wherein:

the wavelength converting element is a first wavelength converting element, the device further comprising a second wavelength converting element comprising a phosphor capable of emitting green or yellow light; and

the first wavelength converting element is disposed between the semiconductor structure and the second wavelength converting element.

Assignments (1)
CHANGE OF NAME Recorded Apr 9, 2018
From: KONINKLIJKE PHILIPS ELECTRONICS N V
To: KONINKLIJKE PHILIPS N.V.
Reel/Frame 046634/0124 →