System, apparatus and method for cooling electronic components
Cooling systems for computers are disclosed. In particular, embodiment of such cooling solutions may effectively be used in conjunction with mobile computers that have a polymer (or other type of) chassis. More specifically, embodiments of the present invention use micro vapor plates to conduct the heat generated by one or more electronic components of a mobile computer to the chassis of the mobile computer such that the heat from the electronic components is conducted into, and spread over, at least a portion of the surface of the chassis. The mobile computer can then be cooled by convection or radiation.
1. A mobile computing device, comprising:
a case formed from a polymer;
a first micro vapor plate formed from a plurality of heat pipes, the first micro vapor plate having a first portion and a second portion, the first portion having a first height and thermally coupled with one or more heat generating components, the second portion having a second height less than the first height, wherein the first micro vapor plate is oriented along a first axis and shaped to conduct heat from the one or more heat generating components to a first area of the case; and
a second micro vapor plate formed from a plurality of heat pipes, the second micro vapor plate having a third portion and a fourth portion, the third portion having a third height less than the first height of the first micro vapor plate, the fourth portion having a fourth height substantially equal to the first height and thermally coupled with the case,
wherein the second portion of the first plate and the third portion of the second plate are coupled to form an overlapping portion, wherein the height of the overlapping portion is substantially equal to the first height,
wherein the second micro vapor plate is oriented along a second axis substantially perpendicular to the first axis and shaped to conduct heat from the second portion of the first micro vapor plate to a second area of the case.
2. The mobile computing device of claim 1 , wherein the one or more heat generating components comprises a processor.
3. The mobile computing device of claim 1 , wherein the one or more heat generating components comprises a memory controller hub.
4. The mobile computing device of claim 1 , wherein the second height is approximately half the first height.
5. The mobile computing device of claim 4 , wherein the first height is approximately 1.2 mm.
6. The mobile computing device of claim 5 , wherein the height of the overlapped portion is approximately 1.2 mm.
7. The mobile computing device of claim 1 , further comprising a layer of graphite between the fourth portion and the case.
8. The mobile computing device of claim 1 , wherein the first portion is thermally coupled with the one or more heat generating components using a pressure sensitive adhesive.
9. The mobile computing device of claim 1 , further comprising a layer of thermal interface material (TIM) between one of the one or more heat generating components and the first portion.
10. The mobile computing device of claim 1 , wherein the fourth portion forms part of the case.
11. The mobile computing device of claim 1 , further comprising a docking station, wherein one or more of the first micro vapor plate and the second micro vapor plate are thermally coupled with the docking station when the mobile computing device is in a docked state,
wherein heat is transferred to the docking station by one or more of the first micro vapor plate and the second micro vapor plate.
12. A system for cooling a mobile computing device, comprising:
a plurality of micro vapor plate assemblies, wherein each micro vapor plate assembly comprises:
a first micro vapor plate formed from a plurality of heat pipes, the first micro vapor plate having a first portion and a second portion, the first portion having a first height and thermally coupled with one or more heat generating components, the second portion having a second height less than the first height, wherein the first micro vapor plate is oriented in a plane along a first axis; and
a second micro vapor plate formed from a plurality of heat pipes, the second micro vapor plate having a third portion and a fourth portion, the third portion having a third height less than the first height of the first micro vapor plate, the fourth portion having a fourth height substantially equal to the first height and thermally coupled with the case,
wherein the second portion of the first plate and the third portion of the second plate are coupled to form an overlapping portion, wherein the height of the overlapping portion is substantially equal to the first height,
wherein the second micro vapor plate is oriented in the plane along a second axis substantially perpendicular to the first axis,
wherein the first micro vapor plate assembly is configured to conduct heat into a first area of the case and the second micro vapor plate assembly is configured to conduct heat into a second area of the case.
13. The system for cooling a mobile computing device of claim 12 , wherein the first micro vapor plate assembly is configured to conduct heat in a first direction and the second micro vapor plate assembly is configured to conduct heat in a second direction.
14. The system for cooling a mobile computing device of claim 12 , wherein the first direction is opposite the second direction.
15. The system for cooling a mobile computing device of claim 12 , further comprising a docking station, wherein one or more of the first micro vapor plate assembly and the second micro vapor plate assembly are thermally coupled with the docking station when the mobile computing device is in a docked state,
wherein heat is transferred to the docking station by one or more of the first micro vapor plate assembly and the second micro vapor plate assembly.
16. The system for cooling a mobile computing device of claim 12 , wherein the one or more heat generating components comprises a processor.
17. The system for cooling a mobile computing device of claim 12 , wherein the one or more heat generating components comprises a memory controller hub.
18. The system for cooling a mobile computing device of claim 12 , wherein the mobile computing device does not include a fan.
19. The system for cooling a mobile computing device of claim 12 , wherein the second height is approximately half the first height.
20. The system for cooling a mobile computing device of claim 12 , further comprising a layer of graphite between the fourth portion and the case.
21. The system for cooling a mobile computing device of claim 12 , further comprising a layer of thermal interface material (TIM) between one of the one or more heat generating components and the first portion.