Semiconductor device and method of manufacturing the same
View Patent ↗After a plurality of pads ( 2 ) are formed on an insulation film ( 1 ), a passivation film ( 3 ) is formed on the entire surface thereof, and opening parts ( 3 a ) which exposes all the pads ( 2 ) are formed in the passivation film ( 3 ). Next, another passivation film is formed on the entire surface and, for each of the pads ( 2 ), an opening part is formed in this passivation film to expose the central portion of the pad ( 2 ). According to the above method, the probing test can be performed with the opening parts ( 3 a ) formed in the passivation film ( 3 ). Performing the probing test in such a state increases the probability that the probe contacts the pad ( 2 ) since the entire surface of the pad ( 2 ) is exposed, thereby providing the test with a higher accuracy. Thus, the pad can be miniaturized and/or the pitch can be narrowed without requiring a higher accuracy of the probe.
1. A method of manufacturing a semiconductor device comprising:
forming a semiconductor element above a semiconductor substrate;
forming a pad connected to said semiconductor element; and
forming a first passivation film which covers a region in which said semiconductor element is formed, with an entire surface of said pad being exposed,
forming a second passivation film on said first passivation film, said second passivation film covering said region in which said semiconductor element is formed and an edge of said pad with a portion of said pad being exposed.
2. The method of manufacturing the semiconductor device according to claim 1 , wherein said forming said second passivation film comprising:
forming a second film which covers said region in which said semiconductor element is formed and said pad; and
forming an opening part which exposes a portion of said pad in said second passivation film.
3. The method of manufacturing the semiconductor device according to claim 1 , wherein, if a trace of a probe is formed on said pad, said second passivation film is formed so as to cover said trace.
4. The method of manufacturing the semiconductor device according to claim 3 , wherein
a plurality of said pads is formed in alignment along one direction, and
said second passivation film is formed so that said portions of said pads exposed from said second passivation film and said traces are aligned together with in a direction parallel to the direction along which said pads are aligned.
5. The method of manufacturing the semiconductor device according to claim 3 , wherein
a plurality of said pads is formed in alignment along one direction, and
said second passivation film is formed so that said portions of said pads exposed from said second passivation film and said traces are aligned together with in a direction perpendicular to the direction along which said pads are aligned.
6. The method of manufacturing the semiconductor device according to claim 5 , wherein a planar shape of each of said pads is rendered to be a rectangle extending in a direction perpendicular to the direction along which said pads are aligned.
7. The method of manufacturing the semiconductor device according to claim 1 , wherein a SiN film is formed as said first passivation film.