Photolithography Method
A photolithography method is provided which includes: arranging a layout topography in a first mask and a second mask in such a way that at least a layout pattern of the layout topography is defined by an overlap area. The overlap area is formed when at least a first pattern of the first mask and at least a second pattern of the second mask are projected on a common surface and are overlapped to each other. Critical dimensions of the first mask and the second mask are larger than a resolution of a photolithography machine for preventing from bridging.
1 . A photolithography method comprising:
arranging a layout topography in a first mask and a second mask in such a way that at least a layout pattern of the layout topography is defined by an overlap area, the overlap area being formed when at least a first pattern of the first mask and at least a second pattern of the second mask are projected on a common surface and are overlapped to each other;
providing a wafer which includes at least an etch layer and at least a hard mask layer on the etch layer;
transferring the at least a first pattern of the first mask to the hard mask layer; and
forming a second photoresist layer on the hard mask layer and the etch layer, transferring the at least a second pattern of the second mask to the second photoresist layer, and transferring the overlap area to the etch layer according to the hard mask layer and the second photoresist layer for forming the at least a layout pattern of the layout topography on the etch layer.
2 . The photolithography method as claimed in claim 1 , wherein critical dimensions of the first mask are larger than a resolution of a photolithography machine.
3 . The photolithography method as claimed in claim 2 , wherein the critical dimensions of the first mask comprise critical dimensions of the at least first patterns.
4 . The photolithography method as claimed in claim 1 , wherein critical dimensions of the second mask are larger than the resolution of the photolithography machine.
5 . The photolithography method as claimed in claim 4 , wherein the critical dimensions of the second mask comprise critical dimensions of the at least second patterns.
6 . The photolithography method as claimed in claim 1 , wherein the step of providing a wafer comprises:
providing a substrate;
forming an etch layer on the substrate; and
forming a hard mask layer on the etch layer.
7 . The photolithography method as claimed in claim 1 , wherein the step of transferring the at least a first pattern of the first mask to the hard mask layer, comprises:
forming a first photoresist layer on the hard mask layer of the wafer;
transferring the at least a first pattern of the first mask to the first photoresist layer by exposure and development;
transferring the at least a first pattern to the hard mask layer according to the first photoresist layer by etching; and
removing the first photoresist layer.
8 . The photolithography method as claimed in claim 1 , wherein in the step of transferring the at least a first pattern of the first mask to the hard mask layer, gas used for etching is a mixture of Trifluoromethane and Argon with volume ratio of 1:3 to 1:0.3.
9 . The photolithography method as claimed in claim 1 , wherein the first photoresist layer and the second photoresist layer are respectively formed of positive photoresist.
10 . The photolithography method as claimed in claim 9 , wherein in the step of transferring the at least a first pattern of the first mask to the hard mask layer, a part of the first photoresist layer is exposed to form a first exposed part corresponding to the at least a first pattern of the first mask.
11 . The photolithography method as claimed in claim 9 , wherein in the step of transferring the overlap area to the etch layer, a part of the etch layer is exposed to form a second exposed part corresponding to the overlap area.
12 . The photolithography method as claimed in claim 1 , wherein the step of transferring the overlap area to the etch layer comprises etching the etch layer according to the second photoresist layer and the hard mask layer, gas used for etching being non-reactive with the hard mask layer.
13 . A photolithography method comprising: arranging a layout topography in a first mask and a second mask in such a way that at least a layout pattern of the layout topography is defined by an overlap area, the overlap area being formed when at least a first pattern of the first mask and at least a second pattern of the second mask are projected on a common surface and are overlapped to each other, wherein critical dimensions of the first mask and the second mask are larger than a resolution of a photolithography machine.
14 . The photolithography method as claimed in claim 13 , wherein the critical dimensions of the first mask comprise critical dimensions of the at least first patterns.
15 . The photolithography method as claimed in claim 13 , wherein the critical dimensions of the second mask comprise critical dimensions of the at least second patterns.
16 . The photolithography method as claimed in claim 13 , further comprising: providing a wafer which includes at least an etch layer and at least a hard mask layer on the etch layer, and transferring the at least a first pattern of the first mask to a hard mask layer of a wafer.
17 . The photolithography method as claimed in claim 16 , further comprising:
forming a second photoresist layer on the hard mask layer and the etch layer, transferring the at least a second pattern of the second mask to the second photoresist layer, and transferring the overlap area to the etch layer according to the hard mask layer and the second photoresist layer for forming the at least a layout pattern of the layout topography on the etch layer.
18 . A photolithography method comprising:
arranging a layout topography in a first mask and a second mask in such a way that at least a layout pattern of the layout topography is defined by an overlap area, the overlap area being formed when at least a first pattern of the first mask and at least a second pattern of the second mask are projected on a common surface and are overlapped to each other;
providing a wafer which includes at least an etch layer and at least a hard mask layer on the etch layer;
transferring the at least a first pattern of the first mask to the hard mask layer, the hard mask layer forming a first exposed part corresponding to the at least a first pattern; and
forming a second photoresist layer on the hard mask layer and the etch layer, transferring the at least a second pattern of the second mask to the second photoresist layer, and transferring the overlap area to the etch layer according to the hard mask layer and the second photoresist layer to form at least a layout pattern of the layout topography on the etch layer, wherein the etch layer forms a second exposed part corresponding to the at least a layout pattern.
19 . The photolithography method as claimed in claim 18 , wherein critical dimensions of the first mask and the second mask are larger than a resolution of a photolithography machine.
20 . The photolithography method as claimed in claim 19 , wherein the critical dimensions of the first mask comprise critical dimensions of the at least first patterns, and wherein the critical dimensions of the second mask comprise critical dimensions of the at least second patterns.