Method of three dimensionally locating printhead on printer
View Patent ↗A method of locating a printhead on a printer is provided in which a printhead is provided which has at least one integrated circuit having a plurality of ejection nozzles, the printhead is mounted to the printer by bringing each of a slot defined with respect to the x-coordinate of the printhead into cooperation with a mesa feature of the printer, an angled surface defined with respect to the x- and y-coordinates of the printhead into cooperation with a protrusion across the slot of the printer, and a flat surface defined with respect to the z-coordinate of the printhead into cooperation with protrusion located within the slot of the printer, and the location of the nozzles with respect to the x-, y- and z-coordinates is determined from the cooperation.
1. A method of locating a printhead on a printer, the method comprising the steps of:
providing a printhead comprising at least one integrated circuit having a plurality of ejection nozzles;
mounting the printhead to the printer by bringing each of a slot defined with respect to the x-coordinate of the printhead into cooperation with a mesa feature of the printer, an angled surface defined with respect to the x- and y-coordinates of the printhead into cooperation with a protrusion across the slot of the printer, and a flat surface defined with respect to the z-coordinate of the printhead into cooperation with protrusion located within the slot of the printer; and
determining from the cooperation the location of the nozzles with respect to the x-, y- and z-coordinates.
2. A method according to claim 1 , wherein the printhead has an elongate ink distribution support mounting the, or each, integrated circuit so that the, or each, integrated circuit extends longitudinally along the elongate support.
3. A method according to claim 2 , wherein the, or each, integrated circuit is mounted along the elongate support so that the nozzles create a printing zone which extends across a pagewidth.
4. A method according to claim 2 , wherein the elongate support is formed as a molding, and the slot, angled surface and flat surface are molded as part of the support molding.
5. A method according to claim 2 , wherein the flat surface is provided at either longitudinal end of the elongate support.
6. A method according to claim 2 , wherein the slot is defined in the ink distribution support.
7. A method according to claim 2 , wherein the flat surface is defined at a plurality of corners of the ink distribution support.
8. A method according to claim 3 , wherein the slot, angled surface and flat surface are arranged beyond the longitudinal extent of the printing zone.
9. A method according to claim 4 , wherein the molding is formed from liquid crystal polymer.
10. A method according to claim 9 , wherein the integrated circuit is formed from a silicon wafer.
11. A method according to claim 10 , wherein the liquid crystal polymer of the ink distribution support has thermal expansion characteristics similar to those of the silicon of the integrated circuit.