IP Library Granted Patent US 8,120,910
Granted Patent B2
US 8,120,910 · App. 12/781,784 · Granted Feb 21, 2012

Heat dissipating structure

Assignee: Wistron Corporation
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Quick Facts
Patent No.
US 8,120,910
App. No.
12/781,784
Granted
Feb 21, 2012
Kind
B2
Abstract

A heat dissipating structure includes a frame. An accommodating space is formed inside the frame for accommodating a fan, and an opening is formed on a lateral side of the frame. The heat dissipating structure further includes at least one shutter connected to the frame in a rotatable manner. The fan is disposed on a side of the shutter. The shutter prevents airflow driven by the fan from flowing back to the other side of the shutter through the opening when the shutter rotates to a close position. The heat dissipating structure further includes a resilient component for providing a resilient force to the shutter so as to drive the shutter to the close position.

Claims (18)

1. A heat dissipating structure comprising:

a frame forming an accommodating space inside and an opening being formed on a lateral side of the frame;

a plurality of shutters, each of the plurality of shutters pivoted to the frame;

a linkage connected to the plurality of shutters so as to drive the plurality of shutters simultaneously, the linkage having at least one protruding part disposed on a side of the linkage contacting the frame for reducing friction between the linkage and the frame; and

a resilient component for rotating the plurality of shutters to a close position.

2. The heat dissipating structure of claim 1 , wherein the resilient component is connected to one shutter of the plurality of shutters, and the linkage drives the other shutters of the plurality of shutters to rotate in a direction whereto the resilient component drives the plurality of shutters.

3. The heat dissipating structure of claim 1 , wherein the resilient component is connected to the linkage.

4. An electronic device comprising:

a heat source; and

a heat dissipating module for dissipating heat generated by the heat source, comprising:

a fan for driving airflow so as to dissipate the heat generated by the heat source; and

a heat dissipating structure for guiding the airflow driven by the fan, the heat dissipating structure comprising:

a frame forming an accommodating space inside for accommodating the fan and an opening being formed on a lateral side of the frame;

a plurality of shutters, each of the plurality of shutters connected to the frame in a rotatable manner for preventing air from flowing through the opening when the plurality of shutters rotates to a close position; and

a linkage connected to the plurality of shutters so as to drive the plurality of shutters simultaneously, the linkage having at least one protruding part disposed on a side of the linkage contacting the frame for reducing friction between the linkage and the frame;

a resilient component for providing a resilient force to the plurality of shutters so as to drive the plurality of shutters to the close position.

5. The electronic device of claim 4 , wherein the resilient component is connected to one of shutter of the plurality of shutters, and the linkage drives the other shutters of the plurality of shutters to rotate in a direction whereto the resilient component drives the plurality of shutters.

6. The electronic device of claim 4 , wherein the resilient component is connected to the linkage.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 17, 2010
From: HONG, WEI-LING
To: WISTRON CORPORATION
Reel/Frame 024398/0215 →
Priority Claims (1)
TW 99204612 U · Mar 16, 2010 · national
Continuity (1)
Related Publication 20110228477A1 · Sep 22, 2011