IP Library Granted Patent US 9,006,669
Granted Patent B2
US 9,006,669 · App. 12/782,074 · Granted Apr 14, 2015

Radiation detector

Inventors: Hitoshi Chiyoma (Otawara, JP); Hiroshi Iwata (Otawara, JP)
Assignee: Kabushiki Kaisha Toshiba
G01T1/2018H05K1/147
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Quick Facts
Patent No.
US 9,006,669
App. No.
12/782,074
Granted
Apr 14, 2015
Kind
B2
Abstract

According to one embodiment, a radiation detector includes a photodetector including a fluorescent film configured to convert radiation into light, and a photoelectric conversion element configured to convert light into an electrical signal, a circuit board configured to electrically drives the photodetector, and electronically processes an output signal from the photodetector, and a connection board configured to electrically connect the photodetector and circuit board, and including a flexible circuit board, and an IC mounting board connected to the flexible circuit board, less flexible than the flexible circuit board, and including an IC semiconductor element.

Claims (17)

1. A radiation detector comprising:

a fluorescent film configured to convert radiation into light;

a photodetector comprising a photodiode and a thin-film transistor, the photodiode configured to convert the light into an electrical signal;

a first circuit board configured to electrically drive the photodetector and electronically process an output signal from the photodetector;

a connection board configured to electrically connect the photodetector and the first circuit board;

the connection board including:

(a) flexible circuit board, and

(b) an IC mounting board that is connected to the flexible circuit board, the IC mounting board having rigidity and being less flexible than the flexible circuit board,

the IC mounting board including:

(c) an IC semiconductor element that is bump-connected onto the IC mounting board, and

(d) a connector; and

a casing configured to house the photodetector, the first circuit board, and the connection board,

wherein the flexible circuit board comprises one end which is electrically connected to the photodetector using an anisotropic conductive film and another end which is electrically connected to the IC mounting board, and is bent inside the casing, and

wherein the IC mounting board is electrically connected to the first circuit board and fixed at a predetermined position in the casing, using the connector.

2. The radiation detector according to claim , 1 wherein the IC semiconductor element includes a signal detection semiconductor element having an electrical amplification function.

3. The radiation detector according to claim 1 , wherein the IC semiconductor element includes a photodetector driving element to drive the photodetector .

4. The radiation detector according to claim 1 , wherein the IC mounting board is a multilayer circuit board with a trace configuration that facilitates electrical connectivity between the IC semiconductor element, the flexible circuit board, and the first circuit board.

Assignments (3)
CHANGE OF NAME Recorded Dec 11, 2018
From: TOSHIBA ELECTRON TUBES & DEVICES CO., LTD.
To: CANON ELECTRON TUBES & DEVICES CO., LTD.
Reel/Frame 047788/0490 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 2, 2016
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA ELECTRON TUBES & DEVICES CO., LTD.
Reel/Frame 038773/0680 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 18, 2010
From: CHIYOMA, HITOSHI; IWATA, HIROSHI
To: KABUSHIKI KAISHA TOSHIBA; TOSHIBA ELECTRON TUBES & DEVICES CO., LTD.
Reel/Frame 024401/0130 →
Priority Claims (1)
JP 2007-298864 · Nov 19, 2007 · national
Continuity (2)
Continuation PCTJP2008069954 · Oct 31, 2008
Related Publication 20100224785A1 · Sep 9, 2010