Method of assembling pagewidth printhead

1. A method of assembling a pagewidth printhead, said method comprising the steps of:

(a) providing a pagewidth ink supply manifold having a plurality of ink outlets defined in a manifold bonding surface thereof;

(b) providing a laminated film having a plurality of ink supply holes defined therein, said laminated film comprising a central polymeric film sandwiched between first and second adhesive layers, wherein a first melt temperature of said first adhesive layer is at least 10° C. less than a second melt temperature of said second adhesive layer;

(c) aligning said film with said ink supply manifold such that each ink supply hole is aligned with a respective ink outlet;

(d) bonding said first adhesive layer to said manifold bonding surface;

(e) heating a printhead integrated circuit and positioning said heated printhead integrated circuit on the second adhesive layer such that at least one ink supply hole is aligned with an ink inlet defined in a printhead bonding surface of said printhead integrated circuit; and

(f) repeating step (e) to provide said pagewidth printhead comprised of a plurality of abutting printhead integrated circuits bonded to said ink supply manifold.

2. The method of claim 1 , wherein, in step (d), said first adhesive layer is heated to a temperature less than a melt temperature of said second adhesive layer.

3. The method of claim 1 , wherein said first melt temperature is at least 20° C. less than said second melt temperature.

4. The method of claim 1 , wherein substantially no adhesive flows into said ink supply holes during at least step (d).

5. The method of claim 4 , wherein step (e) comprises optically locating a centroid of each ink supply hole, wherein said locating step is facilitated by an absence of adhesive from said ink supply holes.

6. The method of claim 1 , wherein each ink supply hole has a length dimension in the range of 50 to 500 microns, and a width dimension in the range of 50 to 500 microns.

7. The method of claim 1 , wherein said laminated film maintains its structural integrity after step (d), such that said second adhesive layer maintains a uniform thickness along its longitudinal extent.

8. The method of claim 1 , wherein said laminated film maintains its structural integrity after step (d), such that a second bonding surface defined by said second adhesive layer maintains uniform planarity along its longitudinal extent.

9. The method of claim 1 , wherein each printhead integrated circuit comprises a plurality of ink inlets defined by an ink supply channel extending longitudinally along said printhead bonding surface, and wherein a plurality of ink supply holes are aligned with one ink supply channel, each of said plurality of ink supply holes being spaced apart longitudinally along said ink supply channel.

10. The method of claim 1 , wherein said central polymeric film is a polyimide film.

11. The method of claim 1 , wherein said first and second adhesive layers are epoxy films.

12. The method of claim 1 , wherein a total thickness of said laminated film is in the range of 40 to 200 microns.

13. The method of claim 1 , wherein said central polymeric film has a thickness in the range of 20 to 100 microns.

14. The method of claim 1 , wherein said first and second adhesive layers each have a thickness in the range of 10 to 50 microns.