Hard disk drive having desiccant member
View Patent ↗A hard disk drive effectively removes internal humidity therefrom and thus improves the reliance and performance of the hard disk drive in high and increased humidity environments.
1. An apparatus comprising:
a base internally provided with a plurality of internal parts related to reading and writing information;
a printed circuit board assembly (PCBA) mounted with a plurality of parts on a surface thereof and coupled to one side of the base;
a desiccant through hole penetrating the base along a thickness direction of the base and disposed above a heat generating source on the PCBA in the thickness direction that generates heat when operating among the plurality of parts mounted to the PCBA; and
a desiccant member provided on the base above the desiccant through hole in the thickness direction and absorbing and discharging internal humidity of the base to an outside via the desiccant through hole.
2. The apparatus according to claim 1 , wherein the heat generating source comprises at least one controller chip mounted to the surface of the PCBA and performing control related to reading and writing the information.
3. The apparatus according to claim 2 , wherein the heat generating source comprises at least one memory chip mounted to the surface of the PCBA and storing data and a table.
4. The apparatus according to claim 3 , wherein
the PCBA is coupled to a rear side of the base; and
the desiccant through hole is disposed between the controller chip and the memory chip.
5. The apparatus according to claim 4 , further comprises a desiccant member seating part on a bottom portion of the base, where the desiccant member is at least partially accommodated and coupled.
6. The apparatus according to claim 4 , further comprising a fitting projection which protrudes from a bottom surface inside the base and to which the desiccant member is fitted.
7. The apparatus according to claim 6 , wherein the fitting projection comprises a straight type or a hook type an end of which is bent.
8. The apparatus according to claim 3 , wherein
the PCBA is coupled to a rear surface of the base and the heat generating source is mounted to a rear surface of the PCBA, and
the PCBA further comprises a hole that communicates with the desiccant through hole.
9. The apparatus according to claim 1 , wherein the desiccant through hole is plurally provided to correspond to one of the desiccant member.
10. The apparatus according to claim 1 , wherein at least one set of the desiccant through hole and the desiccant member is provided in every region of a heat generating source on the PCBA.
11. The apparatus according to claim 1 , wherein the desiccant member contacts the desiccant through hole.
12. The apparatus according to claim 1 , wherein the desiccant member is coupled to the base by an adhesive resin.
13. The apparatus according to claim 1 , further comprising a first region disposed between the PCBA and the base member having a high temperature and a second region disposed above the base member having a lower temperature than the temperature of the first region.
14. An apparatus comprising:
a printed circuit board assembly (PCBA) having a plurality of active and passive components including at least one controller and at least one memory device thereon;
a base member including a plurality of disks and a head stack assembly connected to the PCBA by a flexible printed circuit board;
a cover coupled to a top of the base to form an internal space within the base member;
a gasket interposed between the cover and the base to keep airtightness between the cover and the base;
a desiccant member formed in a bottom portion of the base member above the PCBA to absorb humidity within the internal space; and
at least one through hole positioned below the desiccant member to output humidity absorbed by the desiccant member.
15. The apparatus according to claim 14 , wherein the humidity is output external to the hard drive.
16. The apparatus according to claim 15 , wherein the heat from the controller or memory device prevents the desiccant member from being fully saturated.
17. The apparatus according to claim 14 , wherein at least one of the controller and memory device heats the desiccant member through the through hole to create a temperature grade within the desiccant member.
18. The apparatus according to claim 14 , further comprising a plurality of through holes positioned adjacent each of the controller and memory device.
19. The apparatus according to claim 14 , further comprising a desiccant liner disposed within the at least one through hole.