IP Library Granted Patent US 8,256,300
Granted Patent B2
US 8,256,300 · App. 12/789,214 · Granted Sep 4, 2012

Pressure sensor

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Quick Facts
Patent No.
US 8,256,300
App. No.
12/789,214
Granted
Sep 4, 2012
Kind
B2
Abstract

A pressure sensor includes a sense element port, a support ring and a plurality of interference fit slits to provide a flexible interference fit between the sense element port and the support ring to form a substantially flush lap joint. The sensor also includes an electronics board inside the support ring and attached to planar mounting tabs which provide a stable mounting. Gel flow barriers protect electronics board features from unwanted non-conductive gel. Double-ended symmetrical, tapered contact springs provide manufacturing cost savings and contribute to improved alignment of an interface connector of the sensor.

Claims (13)

1. A contact housing sub-assembly comprising:

an upper spring guide that retains retaining an elastic contact member; and

a lower spring guide adapted to attach to the upper spring guide,

wherein the elastic contact member comprises a double-ended symmetrical spring having dual tapered ends such that a contact point at each end of the double-ended symmetrical spring is closer to a center axis of the double-ended symmetrical spring.

2. The sub-assembly of claim 1 , wherein the double-ended symmetrical spring is variably-pitched to minimize tangling and thereby facilitate automatic assembly.

3. The sub-assembly of claim 1 , wherein the upper spring guide is snap fit to the lower spring guide.

4. The sub-assembly of claim 1 , wherein the double-ended symmetrical spring includes a spring tip center aligned to a center of a contact receiving pad.

5. The sub-assembly of claim 4 , wherein the dual tapered ends are conically tapered to further align the spring tip center towards the center of the contact receiving pad.

6. The sub-assembly of claim 1 , wherein the upper and lower spring guides have mating orientation features to ensure proper alignment.

7. The sub-assembly of claim 1 , wherein the double-ended symmetrical spring includes a plurality of dead coils at a first end, a plurality of dead coils at a second end and a plurality of active coils disposed between the first and second end.

8. The sub-assembly of claim 7 , wherein the upper spring guide includes an enclosure surrounding at least a portion of the plurality of active coils.

9. The sub-assembly of claim 7 , wherein a portion of the plurality of active coils have a variable pitch.

10. The contact housing sub-assembly according to claim 1 , wherein the contact housing sub-assembly is contained in a control system that uses an electronic control unit.

Assignments (2)
SECURITY AGREEMENT Recorded May 18, 2011
From: SENSATA TECHNOLOGIES FINANCE COMPANY, LLC; SENSATA TECHNOLOGIES, INC.; SENSATA TECHNOLOGIES MASSACHUSETTS, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 026304/0686 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 27, 2010
From: WILLNER, ANDREW F.; TOMASSO, LOUIS; FRAONE, GIOVANNI; AMBADY, PRASANTH
To: SENSATA TECHNOLOGIES, INC.
Reel/Frame 024452/0151 →