Method and system for converting RF power to DC power utilizing a leaky wave antenna
View Patent ↗Methods and systems for converting RF power to DC power utilizing a leaky wave antenna (LWA) are disclosed and may include receiving RF wireless signals utilizing one or more LWAs in a wireless device, and generating one or more DC voltages from the received RF signals utilizing cascaded rectifier cells. A resonant frequency of the LWAs may be configured utilizing micro-electro-mechanical systems (MEMS) deflection. The LWAs may be configured to receive the RF signals from a desired direction. The LWAs may comprise microstrip or coplanar waveguides, wherein a cavity height of the LWAs is dependent on a spacing between conductive lines in the waveguides. The LWAs may be integrated in one or more integrated circuits, integrated circuit packages, and/or printed circuit boards. The packages may be affixed to one or more printed circuit boards and the integrated circuits may be flip-chip-bonded to the packages.
1. A method for communication, the method comprising:
receiving RF wireless signals utilizing one or more leaky wave antennas in a wireless device; and
generating one or more DC voltages for use in said wireless device from said received RF signals utilizing cascaded rectifier cells.
2. The method according to claim 1 , comprising configuring a resonant frequency of said one or more leaky wave antennas utilizing micro-electro-mechanical systems (MEMS) deflection.
3. The method according to claim 1 , comprising configuring said one or more leaky wave antennas to receive said RF signals from a desired direction.
4. The method according to claim 1 , wherein said one or more leaky wave antennas comprise microstrip waveguides.
5. The method according to claim 4 , wherein a cavity height of said one or more leaky wave antennas is dependent on a spacing between conductive lines in said microstrip waveguides.
6. The method according to claim 1 , wherein said one or more leaky wave antennas comprise coplanar waveguides.
7. The method according to claim 6 , wherein a cavity height of said one or more leaky wave antennas is dependent on a spacing between conductive lines in said coplanar waveguides.
8. The method according to claim 1 , wherein said one or more leaky wave antennas are integrated in one or more integrated circuits flip-chip bonded to one or more integrated circuit packages.
9. The method according to claim 1 , wherein said one or more leaky wave antennas are integrated in one or more integrated circuit packages affixed to one or more printed circuit boards.
10. The method according to claim 1 , wherein said one or more leaky wave antennas are integrated in one or more printed circuit boards.
11. A system for enabling communication, the system comprising:
a wireless device comprising one or more leaky wave antennas, wherein said wireless device is operable to:
receive RF wireless signals utilizing said one or more leaky wave antennas; and
generate one or more DC voltages for use in said wireless device from said received RF signals utilizing cascaded rectifier cells.
12. The system according to claim 11 , wherein said wireless device is operable to configure a resonant frequency of said one or more leaky wave antennas utilizing micro-electro-mechanical systems (MEMS) deflection.
13. The system according to claim 11 , wherein said wireless device is operable to configure said one or more leaky wave antennas to receive said RF signals from a desired direction.
14. The system according to claim 11 , wherein said one or more leaky wave antennas comprise microstrip waveguides.
15. The system according to claim 14 , wherein a cavity height of said one or more leaky wave antennas is dependent on a spacing between conductive lines in said microstrip waveguides.
16. The system according to claim 11 , wherein said one or more leaky wave antennas comprise coplanar waveguides.
17. The system according to claim 16 , wherein a cavity height of said one or more leaky wave antennas is dependent on a spacing between conductive lines in said coplanar waveguides.
18. The system according to claim 11 , wherein said one or more leaky wave antennas are integrated in one or more integrated circuits flip-chip bonded to one or more integrated circuit packages.
19. The system according to claim 11 , wherein said one or more leaky wave antennas are integrated in one or more integrated circuit packages affixed to one or more printed circuit boards.
20. The system according to claim 11 , wherein said one or more leaky wave antennas are integrated in one or more printed circuit boards.