Mechanical isolation for MEMS electrical contacts

1. A MEMS substrate, comprising;

a central planar portion configured to support a MEMS device;

a first electrical pad coplanar with the central planar portion, the first electrical pad being connected to the central planar portion through a first flexure, wherein the first flexure is configured to substantially mechanically isolate the first electrical pad from the central planar portion; and

a second electrical pad coplanar with the central planar portion, the second electrical pad being mechanically decoupled from the first electrical pad except through a second flexure connecting the second electrical pad to the central planar portion and configured to substantially mechanically isolate the second ad from the central planar portion.

2. The MEMS substrate of claim 1 , wherein the central planar portion, the first electrical pad, and the first flexure comprise a micro-machined semiconductor wafer.

3. The MEMS substrate of claim 2 , wherein the semiconductor wafer is a monolithic semiconductor wafer.

4. The MEMS substrate of claim 1 , wherein the first and second flexures are corrugated flexures.

5. The MEMS substrate of claim 4 , wherein a depth for the first and second flexures is at least ten times a width for the first and second flexures.

6. The MEMS substrate of claim 5 , wherein the first flexure is configured to conduct an electrical current and the second flexure is configured to conduct the electrical current through an adjacent metal or polysilicon layer.

7. A MEMS device comprising:

a mounting substrate having a planar surface and including a plurality of base mounts that project from the planar surface; and

a planar MEMS substrate including a central portion and a plurality of mounts, wherein

each mount is isolated from the central portion through one of a plurality of corresponding mount flexures,

each mount is configured to engage with a corresponding one of the base mounts, and

the planar MEMS substrate further includes a plurality of coplanar electrical pads, each coplanar electrical pad being mechanically isolated from the central portion and the other coplanar electrical pads except through a corresponding one of a plurality of soft flexures respectively connecting the coplanar electrical pads to the central portion.

8. The MEMS device of claim 7 , wherein the plurality of base mounts comprises three base mounts, the plurality of mounts comprises three mounts, and the plurality of coplanar electrical pads comprises two coplanar electrical pads.

9. The MEMS device of claim 8 , wherein each mount flexure is relatively stiff in two degrees of freedom (DOFs) but relatively less stiff in additional DOFs, and wherein each soft flexure is relatively soft in both the two DOFs and the additional DOFs.

10. The MEMS device of claim 7 , wherein each mount is at a periphery of the MEMS substrate and wherein each coplanar electrical pad is also at the periphery of the MEMS substrate.

11. The MEMS device of claim 10 , wherein each soft flexure is a corrugated flexure that is radially directed towards the MEMS substrate.

12. The MEMS device of claim 7 , further comprising a camera module integrated onto the MEMS substrate.

13. The MEMS device of claim 12 , wherein the camera module is integrated into a cell phone.

14. The MEMS device of claim 7 , wherein the plurality of mount flexures corresponding to each mount comprise two tangentially-directed linear flexures.

15. The MEMS device of claim 7 , further comprising wires bonded to the coplanar electrical pads.

16. The MEMS device of claim 7 , wherein each mount includes a tab opening.