Light emitting device, method of manufacturing the same, light emitting device package, and lighting system
Disclosed are a light emitting device, a method of manufacturing the same, a light emitting device package, and a lighting system. The light emitting device includes a conductive support member, a light emitting structure layer including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer on the conductive support member, and an electrode on the light emitting structure layer. The conductive support member has a curved lateral surface recessed inward.
1. A semiconductor light emitting device comprising:
a light emitting structure;
a first electrode on the light emitting structure;
a light emitting region protective layer selectively formed under the light emitting structure;
an electrode layer under the light emitting structure and the light emitting region protective layer; and
a conductive support member under the electrode layer,
wherein a curved surface, which is recessed inward, is formed on a lateral side of the conductive support member.
2. The semiconductor light emitting device as claimed in claim 1 , wherein the light emitting region protective layer selectively formed under the light emitting structure along an outer peripheral portion of each chip.
3. The semiconductor light emitting device as claimed in claim 1 , wherein the conductive support member has a thickness of about 10 to 500 μm.
4. The semiconductor light emitting device as claimed in claim 1 , wherein the conductive support member includes at least one selected from the group consisting of Cu, Au, Mo and a carrier wafer.