IP Library Granted Patent US 8,995,937
Granted Patent B2
US 8,995,937 · App. 12/797,029 · Granted Mar 31, 2015

Method and system for controlling power for a power amplifier utilizing a leaky wave antenna

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Quick Facts
Patent No.
US 8,995,937
App. No.
12/797,029
Granted
Mar 31, 2015
Kind
B2
Abstract

Methods and systems for controlling power for a power amplifier utilizing a leaky wave antenna (LWA) are disclosed and may include configuring one or more power amplifiers (PAs) in a wireless device at a desired output power level. The PAs may be coupled to feed points on the LWAs that may exhibit an input impedance corresponding to an output impedance of the PAs. RF signals may be transmitted utilizing the LWAs. A resonant frequency of the LWAs may be configured utilizing micro-electro-mechanical systems (MEMS) deflection. The LWAs may be configured to transmit the RF signals in a desired direction. The LWAs may comprise microstrip or coplanar waveguides, wherein a cavity height of the LWAs is dependent on spacing between conductive lines in the waveguides. The input impedances of the feed points may be dependent on a position of the feed points in the cavities.

Claims (27)

1. A method for communication, the method comprising:

configuring a power amplifier in a wireless device to operate at a desired power level;

coupling said configured power amplifier to one of a plurality of feed points within a cavity of a leaky wave antenna, wherein each of said plurality of feed points within said cavity each has a different height, and the one of the plurality of feed points to which the power amplifier is coupled has an input impedance corresponding to an output impedance of said power amplifier; and

transmitting wireless RF signals utilizing said leaky wave antenna via said coupled one of the plurality of feed points.

2. The method according to claim 1 , comprising configuring a resonant frequency of said leaky wave antenna utilizing micro-electro-mechanical systems (MEMS) deflection.

3. The method according to claim 1 , comprising configuring said leaky wave antenna to transmit said RF signals in a desired direction.

4. The method according to claim 1 , wherein said leaky wave antenna comprises a microstrip waveguide.

5. The method according to claim 4 , wherein a cavity height of said leaky wave antenna is dependent on spacing between conductive lines in said microstrip waveguide.

6. The method according to claim 1 , wherein said leaky wave antenna comprises a coplanar waveguide.

7. The method according to claim 6 , wherein a cavity height of said leaky wave antenna is dependent on spacing between conductive lines in said coplanar waveguide.

8. The method according to claim 1 , wherein said input impedances of said plurality of feed points depend on a position of each of said plurality of feed points in said leaky wave antenna.

9. The method according to claim 1 , wherein said leaky wave antenna is integrated in one of: an integrated circuit, an integrated circuit package, or a printed circuit board.

10. The method according to claim 9 , wherein said integrated circuit is flip-chip-bonded to said integrated circuit package that is coupled to said printed circuit board.

11. A system for enabling communication, the system comprising:

a circuit in a wireless device comprising a leaky wave antenna, said circuit including a power amplifier and being configured to:

configure said power amplifier in said wireless device at a desired output power level;

couple said configured power amplifier to one of a plurality of feed points within a cavity of said leaky wave antenna, wherein each of said plurality of feed points within said cavity has a different height, and the one of the plurality of feed points to which the power amplifier is coupled has an input impedance corresponding to an output impedance of said configured power amplifier; and

transmit wireless RF signals utilizing said leaky wave antenna via said coupled one of the plurality of feed points.

12. The system according to claim 11 , wherein said circuit configures a resonant frequency of said leaky wave antenna utilizing micro-electro-mechanical systems (MEMS) deflection.

13. The system according to claim 11 , wherein said circuit configures said leaky wave antenna to transmit said RF signals in a desired direction.

14. The system according to claim 11 , wherein said leaky wave antenna comprises a microstrip waveguide.

15. The system according to claim 14 , wherein a cavity height of said leaky wave antenna is dependent on spacing between conductive lines in said microstrip waveguide.

16. The system according to claim 11 , wherein said leaky wave antenna comprises a coplanar waveguide.

17. The system according to claim 16 , wherein a cavity height of said leaky wave antenna is dependent on spacing between conductive lines in said coplanar waveguide.

18. The system according to claim 11 , wherein said input impedances of said plurality of feed points depends on on a position of each of said plurality of feed points in said leaky wave antenna.

19. The system according to claim 11 , wherein said leaky wave antenna is integrated in one of: an integrated circuit, an integrated circuit package, or a printed circuit board.

20. The system according to claim 19 , wherein said integrated circuit is flip-chip-bonded to said integrated circuit package that is coupled to said printed circuit board.

Assignments (7)
CORRECTIVE ASSIGNMENT TO CORRECT THE PATENT NUMBER 9,385,856 TO 9,385,756 PREVIOUSLY RECORDED AT REEL: 47349 FRAME: 001. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Mar 22, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 051144/0648 →
CORRECTIVE ASSIGNMENT TO CORRECT THE EFFECTIVE DATE PREVIOUSLY RECORDED ON REEL 047229 FRAME 0408. ASSIGNOR(S) HEREBY CONFIRMS THE THE EFFECTIVE DATE IS 09/05/2018. Recorded Oct 29, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047349/0001 →
MERGER Recorded Oct 4, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047229/0408 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: BROADCOM CORPORATION
Reel/Frame 041712/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 1, 2017
From: BROADCOM CORPORATION
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041706/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: BROADCOM CORPORATION
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037806/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 7, 2010
From: ROFOUGARAN, AHMADREZA; ROFOUGARAN, MARYAM
To: BROADCOM CORPORATION
Reel/Frame 024646/0465 →