Polymer composites for biomedical applications and methods of making
View Patent ↗A biomedical polymer composite that exhibits ultra-low thermal conductivity properties. In a preferred embodiment, the biomedical polymer composite comprises a base polymer component with a dispersed thermally non-conductive filler component consisting of glass or ceramic nanospheres or microspheres that have a thermal conductivity of less than 5 W/m-K, and preferably less than 2 W/m-K. In one embodiment, the polymer composite has an electrically conductive filler and can be used in a filament for treating arteriovascular malformations. In another embodiment, the polymeric composite can be used as an energy-coupling means to apply energy to tissue.
1. A method of thermally treating tissue, comprising:
selecting a targeted portion of a tissue structure to be treated;
forming a bipolar electrode layer upon the tissue structure adjacent the targeted portion, the bipolar electrode layer comprising first and second conductive layers separated by an insulative layer; and
causing current to flow from the first conductive layer to the second conductive layer, at least a portion of the current flowing around the nonconductive layer and through the targeted portion of the tissue structure,
wherein the first and second conductive layers, and the insulative layer, comprise a flowable material.
2. The method of claim 1 , wherein forming comprises extruding one or more of the first and second conductive layers, and the insulative layer.
3. The method of claim 2 , wherein forming comprises coextruding the first and second conductive layers, and the insulative layer.
4. The method of claim 2 , further comprising extruding the flowable material in an elongate formation.
5. The method of claim 3 , wherein coextruding comprising substantially encapsulating the first and second conductive layers in the insulative layer.
6. The method of claim 2 , wherein extruding comprises manually actuating an extrusion device configured to induce positive flow of the flowable material through the device.
7. The method of claim 1 , wherein the insulative layer comprises a base polymer and a dispersed nonconductive filler.
8. The method of claim 7 , wherein the dispersed nonconductive filler comprises hollow microspheres.
9. The method of claim 7 , wherein the base polymer and dispersed nonconductive filler comprise bio-absorbable materials.
10. The method of claim 7 , wherein the base polymer is selected from the group consisting of: polyamide, polycarbonate, polystyrene, polyacrylonitrile, polyacetal, thermoplastic modified cellulose, polysulfone, thermoplastic polyester, PET, poly(ethyl acrylate), poly(methyl methacrylate), nylon, fluoropolymer, polyvinylidene fluoride, and ethylene tetrafluoroethylene.
11. The method of claim 1 , wherein the insulative layer has a thermal conductivity of less than about 5 W/m-K.
12. The method of claim 1 , wherein the insulative layer comprises a thermochromic material.