System and method for microablation of tissue
View Patent ↗The present invention generally relates to the field of laser treatment of tissue, and particularly, to a system and method for creating microablated channels in skin. The present invention is more particularly directed to treating subsurface tissue through the created channels.
1. A system for treating tissue with light, comprising: a laser device with a pulsed light output and a controller for the laser device, wherein the controller implements a user interface which permits a user to specify input parameters for defining microablation treatment parameters and wherein the controller controls the laser light output to achieve the desired microablation treatment parameters specified by the user; the laser device being selectable through the controller to control the laser device output to produce an ablative pulsed laser output and a non-ablative heating output, the non-ablative heating output heating targeted subsurface tissue to create a thermal affected zone and cause non-ablative collagen remodeling;
wherein the controller is further configured to control the laser light output such that the laser light output comprises a plurality of consecutive pulses, at least one of the plurality of consecutive pulses being an ablative pulsed laser output followed by non-ablative heating, the at least one ablative pulsed output and the non-ablative heating output being overlapping in area of effect on the tissue; and, wherein the at least one ablative laser pulse causes at least one microchannel to be formed in the tissue, the at least one microchannel providing a conduit to apply non-ablative heating to the targeted subsurface tissue;
wherein the light with which the tissue is treated has a wavelength of at least about 9 um;
wherein the at least one microchannel has a width from about 50 to less than about 200 um; and
wherein a plurality of microchannels are formed in the tissue based on a density of microchannels determined by one or more of the microablation treatment parameters or an operator of the system.
2. The apparatus of claim 1 , wherein the at least one microchannel has a predetermined width and predetermined height, and the thermal affected zone has a predetermined volume and shape proximate said microchannel.
3. The method of claim 2 , wherein the thermal affected zone has a cross section in a plane parallel to that surface which increases in diameter with the plane's distance from that surface, so that the diameter of the cross section increases with distance from that surface for a range of distances to the surface.
4. The apparatus of claim 1 , wherein the depth of the at least one microchannel is much greater than its diameter.
5. The apparatus of claim 1 wherein the depth and the width of the at least one microchannel are controlled by one or more of the laser wavelength, pulse duration, pulse width, pulse frequency and power.