IP Library Granted Patent US 9,263,439
Granted Patent B2
US 9,263,439 · App. 12/800,902 · Granted Feb 16, 2016

III-nitride switching device with an emulated diode

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Quick Facts
Patent No.
US 9,263,439
App. No.
12/800,902
Granted
Feb 16, 2016
Kind
B2
Abstract

Some exemplary embodiments of a III-nitride switching device with an emulated diode have been disclosed. One exemplary embodiment comprises a GaN switching device fabricated on a substrate comprising a high threshold GaN transistor coupled across a low threshold GaN transistor, wherein a gate and a source of the low threshold GaN transistor are shorted with an interconnect metal to function as a parallel diode in a reverse mode. The high threshold GaN transistor is configured to provide noise immunity for the GaN switching device when in a forward mode. The high threshold GaN transistor and the low threshold GaN transistor are typically fabricated on the same substrate, and with significantly different thresholds. As a result, the superior switching characteristics of III-nitride devices may be leveraged while retaining the functionality and the monolithic structure of the inherent body diode in traditional silicon FETs.

Claims (30)

1. A III-nitride switching device comprising:

a high threshold III-nitride transistor for being switched by a driver circuit;

a low threshold III-nitride diode connected transistor coupled across said high threshold III-nitride transistor at a common source node and a common drain node, said low threshold III-nitride diode having a gate and a source, said gate being coupled to said source at said common source node;

wherein said high threshold III-nitride transistor comprises a high threshold voltage more than four times larger than a low threshold voltage of said low threshold III-nitride diode connected transistor, and provides noise immunity for said III-nitride switching device in a forward mode;

wherein a low resistance interconnect metal connects said gate and said source of said low threshold III-nitride diode connected transistor so that said low threshold voltage of said low threshold III-nitride diode is substantially equal to a voltage drop of said low threshold III-nitride diode in a reverse mode;

wherein said low threshold III-nitride diode connected transistor functions as a parallel diode for protection of said III-nitride switching device in said reverse mode;

wherein said III-nitride switching device comprises a combination of E-mode and D-mode GaN HEMTs.

2. The III-nitride switching device of claim 1 , wherein said high threshold III-nitride transistor comprises an E-mode GaN HEMT.

3. The III-nitride switching device of claim 1 , wherein said low threshold III-nitride diode connected transistor comprises an E-mode GaN HEMT.

4. The III-nitride switching device of claim 1 , wherein said gate and said source of said low threshold III-nitride diode connected transistor are shorted by said low resistance interconnect metal such that said low threshold III-nitride diode connected transistor functions as said parallel diode.

5. The III-nitride switching device of claim 1 , wherein said high threshold III-nitride transistor is formed by interrupting a 2-DEG conduction channel in said high threshold III-nitride transistor.

6. The III-nitride switching device of claim 5 , wherein said 2-DEG conduction channel is interrupted by trapping charges in a gate region of said high threshold III-nitride transistor.

7. The III-nitride switching device of claim 5 , wherein said 2-DEG conduction channel is interrupted by forming a recess under a gate of said high threshold III-nitride transistor.

8. The III-nitride switching device of claim 1 , wherein said III-nitride switching device is utilized as a switch in a half-bridge circuit.

9. The III-nitride switching device of claim 1 , wherein said driver circuit switches said high threshold III-nitride transistor with a voltage between approximately 0 and 12 volts, and wherein a voltage across a drain and a source of said high threshold III-nitride transistor is between approximately 40 and 600 volts.

10. A GaN switching device comprising:

a high threshold GaN transistor fabricated on a substrate;

a low threshold GaN diode connected transistor fabricated on said substrate;

wherein a high threshold voltage of said high threshold GaN transistor is more than four times larger than a low threshold voltage of said low threshold GaN diode connected transistor;

wherein a gate and a source of said low threshold GaN diode connected transistor are shorted by a low resistance interconnect metal such that said low threshold voltage of said low threshold GaN diode connected transistor is substantially equal to a voltage drop of said low threshold GaN diode connected transistor in a reverse mode to function as a parallel diode;

a drain of said high threshold GaN transistor being shorted to a drain of said low threshold GaN diode connected transistor, and a source of said high threshold GaN transistor being shorted to said source of said low threshold GaN diode connected transistor;

wherein said GaN switching device comprises a combination of E-mode and D-mode GaN HEMTs.

11. The GaN switching device of claim 10 , wherein said high threshold GaN transistor provides noise immunity for said GaN switching device in a forward mode.

12. The GaN switching device of claim 10 , wherein said low threshold GaN diode connected transistor functions as a parallel diode for protection of said GaN switching device in said reverse mode.

13. The GaN switching device of claim 10 , wherein said substrate is selected from the group consisting of a GaN substrate, a silicon carbide substrate, an alumina substrate, and a silicon only substrate.

14. The GaN switching device of claim 10 , wherein said high threshold GaN transistor is formed by interrupting a 2-DEG conduction channel in said high threshold GaN transistor.

15. The GaN switching device of claim 14 , wherein said 2-DEG conduction channel is interrupted by trapping charges in a gate region of said high threshold GaN transistor.

16. The GaN switching device of claim 14 , wherein said 2-DEG conduction channel is interrupted by forming a recess under a gate of said high threshold GaN transistor.

17. The GaN switching device of claim 10 , wherein a threshold voltage of said high threshold GaN transistor is greater than approximately 3 volts.

18. The GaN switching device of claim 10 , wherein a threshold voltage of said low threshold GaN diode connected transistor is less than approximately 0.7 volts.

Assignments (2)
CHANGE OF NAME Recorded Jul 23, 2018
From: INTERNATIONAL RECTIFIER CORPORATION
To: INFINEON TECHNOLOGIES AMERICAS CORP.
Reel/Frame 046612/0968 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 7, 2011
From: ZHANG, JASON
To: INTERNATIONAL RECTIFIER CORPORATION
Reel/Frame 025602/0330 →