Dual-sided thermal print folding
View Patent ↗Dual-sided thermal print folding techniques are presented. A dual-sided thermal printer includes a folding mechanism to custom fold a substrate. The substrate is imaged on both sides by the dual-sided thermal printer as it passes through the dual-sided thermal printer and is custom folded by the folding mechanism of the dual-sided thermal printer.
1. A printer, comprising:
a dual-sided thermal print mechanism; and
a folding mechanism;
the dual-sided thermal printer mechanism configured to activate print images on a substrate that passes through the printer, the substrate coated on both sides with thermally sensitive inks, and the folding mechanism configured to custom fold the substrate before the substrate is dispensed from the printer.
2. The printer of claim 1 , wherein the folding mechanism is a plow folder or a spiral folder integrated into the printer.
3. The printer of claim 1 , wherein the folding mechanism is configured to perform a Z-fold on the substrate.
4. The printer of claim 1 , wherein the folding mechanism is configured to utilize pre-existing perforations, creases, crimps, or die cuts on the substrate to assist in folding the substrate.
5. The printer of claim 1 , wherein the folding mechanism is configured to utilize pre-existing perforations, creases, crimps, or die cuts on the substrate to assist in folding the substrate.
6. The printer of claim 1 , wherein the folding mechanism is configured to be activated before or after the dual-sided thermal print mechanism activates the thermally sensitive inks on the both sides of the substrate.
7. The printer of claim 1 further comprising:
an adhesive application mechanism configured to selectively apply adhesive to the substrate as the substrate passes through the printer.
8. The printer of claim 7 further comprising:
a sealing mechanism configured to selective seal a portion of the substrate that is folded when the substrate passes through the printer.
9. A substrate, comprising:
a first side coated with thermally sensitive inks for activation when Passed through a dual-sided thermal printer;
a second side coated with the thermally sensitive inks for activation when passed through the dual-sided thermal printer; and
a perforation applied to the substrate configured to permit the dual-sided thermal printer to fold the substrate along the perforation as the substrate is passed through the dual-sided thermal printer.
10. The substrate of claim 9 further comprising, an adhesive selected Coated on one or more sides of the substrate that seals a portion of the substrate when the substrate is folded by the dual-sided thermal printer along the perforation.
11. The substrate of claim 10 , wherein the adhesive is configured to be activated by heat, ultraviolet light, or liquid.
12. The substrate of claim 9 , wherein the substrate is configured to be custom cut from a web of media as the web is fed through the dual-sided thermal printer.
13. The substrate of claim 9 , wherein the perforation is to be created on the substrate by the dual-sided thermal printer as the substrate passes through the dual-sided thermal printer.
14. The printer of claim 9 , wherein the perforation is to be prefabricated on the substrate before the substrate passes through the dual-sided thermal printer.
15. A method residing in a non-transitory computer-readable medium and to execute on a dual-sided thermal printer, comprising:
selectively activating thermally sensitive ink on both sides of a substrate in accordance with a print job; and
selectively folding a portion of the substrate in accordance with the print job.
16. The method of claim 15 further comprising, selectively applying adhesive to another portion of the substrate in accordance with the print job.
17. The method of claim 15 further comprising, selectively activating adhesive on the substrate in accordance with the print job or a type associated with the substrate.
18. The method of claim 15 further comprising, selectively sealing the portion of the substrate to another portion of the substrate when folded.
19. The method of claim 15 , wherein selective folding further includes performing a z-fold on the substrate along the portion and another portion of the substrate.
20. The method of claim 15 , wherein selective folding further includes folding along the portion that is a prefabricated perforation on the substrate to assist in folding the substrate.