Nitride semiconductor wafer, nitride semiconductor chip, and method of manufacture of nitride semiconductor chip
View Patent ↗A nitride semiconductor chip is provided that offers enhanced luminous efficacy as a result of an improved EL emission pattern. The nitride semiconductor laser chip (nitride semiconductor chip) has an n-type GaN substrate having as a principal growth plane a plane having an off-angle in the a-axis direction relative to the m plane, and a nitride semiconductor layer formed on the principal growth plane of the n-type GaN substrate. The n-type GaN substrate includes a depressed portion (carved region), which is carved from the principal growth plane in the thickness direction, and an uncarved region, which is a region not carved. The nitride semiconductor layer formed on the n-type GaN substrate has a gradient thickness region whose thickness decreases in a gradient fashion toward the depressed portion (carved region) and an emission portion formation region whose thickness varies very little. In the emission portion formation region 6 , a ridge portion is formed.
1. A nitride semiconductor wafer comprising:
a nitride semiconductor substrate having, as a principal growth plane, a plane having an off-angle in an a-axis direction relative to an m plane; and
a nitride semiconductor layer formed on the principal growth plane of the nitride semiconductor substrate,
wherein the nitride semiconductor substrate includes a carved region, which is a region carved from the principal growth plane in a thickness direction, and an uncarved region, which is a region not carved, and
wherein the nitride semiconductor layer includes a gradient thickness region, which is formed over the uncarved region and whose thickness decreases in a gradient fashion toward the carved region.
2. The nitride semiconductor wafer according to claim 1 ,
wherein a growth suppression film for suppressing growth of a nitride semiconductor is formed in the carved region.
3. The nitride semiconductor wafer according to claim 1 ,
wherein the carved region is formed to extend in a direction crossing the a-axis direction as seen in a plan view.
4. A nitride semiconductor chip formed by use of the nitride semiconductor wafer according to claim 1 .
5. A nitride semiconductor chip comprising:
a nitride semiconductor substrate having, as a principal growth plane, a plane having an off-angle in an a-axis direction relative to an m plane; and
a nitride semiconductor layer formed on the principal growth plane of the nitride semiconductor substrate,
wherein the nitride semiconductor substrate includes a carved region, which is a region carved from the principal growth plane in a thickness direction, and an uncarved region, which is a region not carved, and
wherein the nitride semiconductor layer includes a gradient thickness region, which is formed over the uncarved region and whose thickness decreases in a gradient fashion toward the carved region.
6. The nitride semiconductor chip according to claim 5 ,
wherein a growth suppression film for suppressing growth of a nitride semiconductor is formed in the carved region.
7. The nitride semiconductor chip according to claim 5 ,
wherein the carved region is formed to extend in a direction crossing the a-axis direction as seen in a plan view.
8. The nitride semiconductor chip according to claim 5 ,
wherein an absolute value of the off-angle in the a-axis direction in the nitride semiconductor substrate is larger than 0.1 degrees.
9. The nitride semiconductor chip according to claim 8 ,
wherein the absolute value of the off-angle in the a-axis direction in the nitride semiconductor substrate is 0.5 degrees or larger.
10. The nitride semiconductor chip according to claim 5 , wherein
the nitride semiconductor substrate has an off-angle in a c-axis direction in addition to in the a-axis direction, and
the off-angle in the a-axis direction is larger than the off-angle in the c-axis direction.
11. The nitride semiconductor chip according to claim 5 , wherein
the nitride semiconductor layer has an active layer containing In, and
an In composition ratio in the active layer is 0.15 or more but 0.45 or less.
12. The nitride semiconductor chip according to claim 5 , wherein
the nitride semiconductor layer has a p-type semiconductor layer containing Al, and
an Al composition ratio in the p-type semiconductor layer is 0.08 or more but 0.35 or less.
13. The nitride semiconductor chip according to claim 5 , wherein
the nitride semiconductor layer includes an optical waveguide region, and
the optical waveguide region is located over the uncarved region.
14. The nitride semiconductor chip according to claim 13 , wherein
the optical waveguide region is formed to extend in a c-axis direction as seen in a plan view.
15. The nitride semiconductor chip according to claim 5 , wherein
the nitride semiconductor layer includes a light-emitting region, and
the light-emitting region is located over the uncarved region.
16. The nitride semiconductor chip according to claim 5 ,
wherein the nitride semiconductor substrate is formed of GaN.