Load reduced memory module
A memory module includes a plurality of memory chips and a plurality of data register buffers mounted on the module substrate. At least two memory chips are allocated to each of the data register buffers. Each of the data register buffers includes M input/output terminals (M is a positive integer equal to or larger than 1) that are connected to the data connectors via a first data line and N input/output terminals (N is a positive integer equal to or larger than 2M) that are connected to corresponding memory chips via second and third data lines, so that the number of the second and third data lines is N/M times the number of the first data lines. According to the present invention, because the load capacities of the second and third data lines are reduced by a considerable amount, it is possible to realize a considerably high data transfer rate.
1 . A memory module comprising:
a module substrate including a plurality of data connectors;
a plurality of memory chips mounted on the module substrate, each of the memory chips including at least one data terminal; and
a plurality of data register buffers mounted on the module substrate, each of the data register buffers being assigned to at least two memory chips, wherein
each of the data register buffers includes M first input/output terminals each being connected to an associated one of the data connectors via a first data line formed on the module substrate, where M is a positive integer equal to or larger than 1, and N second input/output terminals each being connected to the data terminal of corresponding memory chips via a second data line formed on the module substrate, where N is a positive integer equal to or larger than 2M, so that number of the second data lines is N/M times number of the first data lines.
2 . The memory module as claimed in claim 1 , wherein each of the data register buffers receives write data transferred via a corresponding first data line, outputs received write data to any one of the second data lines, receives read data transferred via any one of the second data lines, and outputs received read data to the corresponding first data line.
3 . The memory module as claimed in claim 2 , wherein a transfer rate of the write data and the read data transferred via the first data lines and a transfer rate of the write data and the read data transferred via the second data lines are substantially equal to each other.
4 . The memory module as claimed in claim 1 , wherein each of the second data lines is connected to at least two of the corresponding memory chips in common.
5 . The memory module as claimed in claim 4 , wherein at least two of the memory chips connected to same one of the second data lines are arranged close to each other.
6 . The memory module as claimed in claim 5 , wherein two of the memory chips connected to the same second data line are mounted at positions facing each other across the module substrate, respectively.
7 . The memory module as claimed in claim 1 , wherein at least two of the memory chips connected to different one of the second data lines connected to same one of the data register buffers are arranged close to each other.
8 . The memory module as claimed in claim 1 , wherein
the module substrate has a long side and a short side,
the data connectors are arranged along the long side, and
each of the data register buffers, the data connectors corresponding to the data register buffer, and the memory chips corresponding to the data register buffer are arranged in a direction of the short side.
9 . The memory module as claimed in claim 1 , further comprising a command/address/control register buffer that is mounted on the module substrate and includes input terminals, a first output terminal, and a second output terminal, wherein
the module substrate further includes a plurality of command/address/control connectors, each of the input terminals is connected to an associated one of the command/address/control connectors, the first output terminal is connected to the memory chips, and the second output terminal is connected to the data register buffers.
10 . The memory module as claimed in claim 9 , wherein
the command/address/control register buffer includes a register circuit that receives and holds a command/address/control signal supplied via the input terminals, and a control signal generating circuit that generates a control signal based on the command/address/control signal supplied via the input terminals, the command/address/control signal held in the register circuit is supplied to the first output terminal, and
the control signal generated by the control signal generating circuit is supplied to the second output terminal.
11 . The memory module as claimed in claim 10 , wherein
the first output terminal of the command/address/control register buffer is commonly connected to the memory chips, and
the second output terminal of the command/address/control register buffer is commonly connected to the data register buffers.