Semiconductor device, optical print head and image forming apparatus
View Patent ↗A semiconductor device includes three-terminal light emitting element array provided on a substrate, which includes a plurality of three-terminal light emitting elements which are substantially linearly arranged. Each three-terminal light emitting elements includes a first, second and third terminals. The third terminal is used to control a current between the first and second terminals. A Lead-out wiring portion is connected to the plurality of three-terminal light emitting elements. The three-terminal light emitting element array includes a common layer provided between two or more three-terminal light emitting elements adjacent to each other. The common layer mutually connects the second terminals (or the third terminals) of the two or three three-terminal light emitting elements. The lead-out wiring portion includes wirings led from the common layer and the plurality of three-terminal light emitting elements and extending in a direction substantially perpendicular to an arranging direction of the plurality of three-terminal light emitting elements.
1. A semiconductor device comprising:
a substrate;
a three-terminal light emitting element array provided on said substrate and including a plurality of three-terminal light emitting elements which are substantially linearly arranged, each of said plurality of three-terminal light emitting elements including a first terminal, a second terminal and a third terminal, said third terminal being used to control a current between said first and second terminals; and
a lead-out wiring portion connected to said plurality of three-terminal light emitting elements;
wherein said three-terminal light emitting element array includes a common layer formed of a semiconductor layer and provided across two or more three-terminal light emitting elements adjacent to each other, said common layer mutually connecting said second terminals of said two or more three-terminal light emitting elements;
wherein a plurality of electrodes are provided between mutually adjacent three-terminal light emitting elements, said electrodes connecting said lead-out wiring portion and said common layer; and
wherein all of said three-terminal light emitting elements are equally distanced from said electrodes adjacent thereto.
2. The semiconductor device according to claim 1 , wherein said plurality of three-terminal light emitting elements are formed in a semiconductor thin film, and
wherein said semiconductor thin film is bonded to a surface of said substrate.
3. The semiconductor device according to claim 1 ,
wherein said lead-out wiring portion includes wirings led out from said electrodes, and
wherein said wirings are provided at constant intervals in an arranging direction of said plurality of three-terminal light emitting elements.
4. The semiconductor device according to claim 3 , wherein said wirings are provided only on one side of each three-terminal light emitting element.
5. An optical print head comprising:
said semiconductor device according to claim 1 .
6. An image forming apparatus comprising:
said optical print head according to claim 5 ,
an image bearing body having a surface exposed by said optical print head so as to form a latent image;
a developing unit that develops said latent image; and
a transfer unit that transfer said latent image to a medium.
7. The semiconductor device according to claim 1 , wherein said lead-out wiring portion is led out from said common layer in a direction substantially perpendicular to an arranging direction of said plurality of three-terminal light emitting elements.
8. The semiconductor device according to claim 1 , wherein said plurality of three-terminal light emitting elements and said electrodes are arranged substantially linearly in an arranging direction of said plurality of three-terminal light emitting elements.