Display device and method of manufacturing the same
A display device and a method of manufacturing the same, the display device including a substrate, a semiconductor layer on the substrate, a light shielding layer on the substrate, the light shielding layer and the semiconductor layer being positioned directly on a same layer, a gate insulating layer on the substrate covering the semiconductor layer and the light shielding layer, and a gate electrode on the gate insulating layer, the gate electrode corresponding to a channel region of the semiconductor layer.
1 . A display device, comprising:
a substrate;
a semiconductor layer on the substrate;
a light shielding layer on the substrate, the light shielding layer and the semiconductor layer being positioned directly on a same layer;
a gate insulating layer on the substrate covering the semiconductor layer and the light shielding layer; and
a gate electrode on the gate insulating layer, the gate electrode corresponding to a channel region of the semiconductor layer.
2 . The display device as claimed in claim 1 , further comprising:
an interlayer insulating layer on the gate insulating layer covering the gate electrode; and
source and drain electrodes on the interlayer insulating layer, the source and drain electrodes being electrically connected with source and drain regions of the semiconductor layer.
3 . The display device as claimed in claim 1 , further comprising a contamination prevention layer on the semiconductor layer.
4 . The display device as claimed in claim 3 , wherein the contamination prevention layer includes a single silicon oxide layer or a combination of silicon oxide and silicon nitride.
5 . The display device as claimed in claim 3 , wherein a thickness ratio of the contamination prevention layer to the gate insulating layer is in a range of about 1:3 to about 1:1.5.
6 . The display device as claimed in claim 3 , wherein the gate insulating layer is on the contamination prevention layer, and the display device further comprises:
an interlayer insulating layer on the gate insulating layer covering the gate electrode; and
source and drain electrodes on the interlayer insulating layer, the source and drain electrodes being electrically connected with source and drain regions of the semiconductor layer.
7 . The display device as claimed in claim 3 , wherein the contamination prevention layer overlaps an entire upper surface of the semiconductor layer.
8 . The display device as claimed in claim 1 , wherein the light shielding layer includes a metal.
9 . The display device as claimed in claim 8 , wherein the metal includes one or more of aluminum, tungsten, titanium, tantalum, chromium, a chromium alloy, molybdenum, and a molybdenum alloy.
10 . The display device as claimed in claim 1 , wherein the light shielding layer and the semiconductor layer are horizontally spaced apart from each other.
11 . The display device as claimed in claim 1 , wherein a portion of the gate insulating layer is on a same layer as the light shielding layer, the portion of the gate insulating layer separating the light shielding layer and the semiconductor layer.
12 . A method of manufacturing a display device, comprising:
forming a semiconductor layer on a substrate;
forming a light shielding layer on the substrate, the light shielding layer being formed after formation of the semiconductor layer and on a same layer as the semiconductor layer;
forming a gate insulating layer on the substrate, the gate insulating layer covering the semiconductor layer and the light shielding layer; and
forming a gate electrode on the gate insulating layer, the gate electrode corresponding to a channel region of the semiconductor layer.
13 . The method as claimed in claim 12 , further comprising forming a contamination prevention layer on the semiconductor layer, the contamination prevention layer being formed before forming the light shielding layer.
14 . The method as claimed in claim 13 , wherein the contamination prevention layer is formed of a single silicon oxide layer or a combination of silicon oxide and silicon nitride.
15 . The method as claimed in claim 14 , wherein a thickness ratio of the contamination prevention layer to the gate insulating layer is formed in a range of about 1:3 to about 1:1.5.
16 . The method as claimed in claim 13 , wherein the gate insulating layer is formed on the contamination prevention layer, and the method further comprises:
forming an interlayer insulating layer on the gate insulating layer having the gate electrode;
partially exposing source and drain regions of the semiconductor layer by removing parts of the contamination prevention layer, the gate insulating layer, and the interlayer insulating layer;
patterning and forming source and drain electrodes on the interlayer insulating layer;
forming a planarization layer on the interlayer insulating layer including the source and drain electrodes to partially expose one of the source and drain electrodes;
forming a pixel electrode on the planarization layer;
forming a pixel defining layer on the planarization layer including the pixel electrode, the pixel defining layer partially exposing the pixel electrode;
forming an organic layer including an organic light emitting layer on the exposed pixel electrode; and
forming a counter electrode on the pixel defining layer including the organic layer.
17 . The method as claimed in claim 12 , wherein the light shielding layer is formed of a metal.
18 . The method as claimed in claim 17 , wherein the metal includes one or more of aluminum, tungsten, titanium, tantalum, chromium, a chromium alloy, molybdenum, and a molybdenum alloy.
19 . The method as claimed in claim 12 , further comprising:
forming an interlayer insulating layer on the gate insulating layer having the gate electrode;
partially exposing source and drain regions of the semiconductor layer by removing parts of the gate insulating layer and the interlayer insulating layer;
patterning and forming source and drain electrodes on the interlayer insulating layer;
forming a planarization layer on the interlayer insulating layer including the source and drain electrodes to partially expose one of the source and drain electrodes;
forming a pixel electrode on the planarization layer;
forming a pixel defining layer on the planarization layer including the pixel electrode, the pixel defining layer partially exposing the pixel electrode;
forming an organic layer including an organic light emitting layer on the exposed pixel electrode; and
forming a counter electrode on the pixel defining layer including the organic layer.
20 . The method as claimed in claim 12 , wherein forming the light shielding layer includes:
depositing a layer on the substrate; and
etching the layer to form the light shielding layer on the same layer as the semiconductor layer, such that a position of the light shielding layer is horizontally spaced apart from the semiconductor layer.